| A | Jan Vardaman | TechSearch International, Inc., USA | Al Packaging Trends and Challenges |
| B | Kim SoYoung | Sungkyunkwan University, Korea | AI-Driven Approaches to Semiconductor Package Design |
| C | Akane Tsukahara | Taiyo Ink Mfg. Co., Ltd., Japan | Development of Low-Loss Photo-Dielectric Dry Film for Redistribution Layers in High-Speed Packaging |
| C | Hironari Mori | Sumitomo Bakelite Co., Ltd., Japan | Development of Low Temperature Curable Photosensitive Material for Redistribution Layer |
| E | An Jinho | Applied Materials, Inc., Korea | Innovative Solutions in Addressing the Complexity of Hybrid Copper Bonding Technology |
| F | Wisnu Murti | ELSPES Inc., Korea | Enabling Advanced Integration with Deep Trench Silicon Capacitors |
| G | Takatoshi Ikeuchi | Resonac Corporation, Japan | Co-Creating the Future of Materials Innovation in Advanced Packaging |
| H | Song Jenn-Ming | National Chung Hsing University, Taiwan | Light Enhanced Direct Metal Bonding for Advanced Electronic Assembly |
| H | Lee Chang-Chun | National Tsing Hua University, Taiwan | Warpage Estimation and Demonstration of Panel-level Fan-out Packaging with Cu Pillars Applied on a Highly Integrated Architecture |
| H | Wu Albert T. | National Central University, Taiwan | Sintering Behavior and Bonding Mechanisms of Copper Nanoparticles for Advanced Electronic Packaging |
| H | Lee Ming-Tsang | National Tsing Hua University, Taiwan | Sustainable Laser Micro/Nanofabrication for 3D Electronics: Novel Processes Development, Transport Phenomena, and Digital Twin |
| I | Cho Wonsub | BASF, Korea | Recent Development in Cu-Cu Hybrid Bonding: BASF's Innovations and Key Challenge |
| I | Kasbauer Thomas | EV Group, Austria | Enabling 3D Integration: Advanced in Hybrid Wafer Bonding Technology |
| J | Park YongKeun | Tomocube Inc., Korea | Holotomography: Advancing Metrology and Inspection for Microelectronics and Advanced Packaging |
| L | Go Hamasaka | Tokuyama Corporation, Japan | High Thermal Conductive Aluminum Nitride Fillers for Thermal Management in Electronic Packaging |
| L | Shiori Yamada | ULVAC, Inc., Japan | Manufacturing Transformation Era: Process Solution Technologies for Panel-Level Packaging Based on Wafer-Level Quality |
| L | Shinji Kato | Mitsubishi Materials Corporation, Japan | Introduction of Rectangle Si Panel Technology for Advanced Packaging |
| L | Hirotaka Satori | EBARA Corporation, Japan | Integrated Systems Strategy from the Viewpoint of an Equipment Supplier in the Advanced Packaging Era |
| M | Ryohei Oishi | Ajinomoto Co., Inc., Japan | Insulation Materials for Advanced Packaging Applications |
| N | Yoo Sehoon | Korea Institute of Industrial Technology (KITECH), Korea | Microstructural and Mechanical Reliability of Fine-Pitch Interconnects Formed by LAB and TCB |
| O | Koo BonTae | Electronics and Telecommunications Research Institute (ETRI), Korea | Energy-Efficient 10-Chiplet Hyperscale AI Semiconductor on Advanced Large-Scale RDL Package |
| P | Im Yunhyeok | Georgia Institute of Technology, USA | Holistic Thermal Solution for Heterogeneously Integrated High-Power Packages |
| Q | Yi Yongsang | LPKF Laser & Electronics Korea Ltd., Korea | Development of Glass Substrates and Trend Change Using LIDE |
| Q | Jeon Eunsuk | Laserapps Co., Ltd., Korea | Micro-Crack Free Laser Singulation and Melting TGV for Glass Substrate and Interposer |
| Q | Jung Il Hyung | BSP Co., Ltd., Korea | TGV (Through glass via) Formation Using a Femtosecond Pulsed Laser |
| R | Choi MiKyoung | Amkor Technology, Korea | Robust Material Design and Development Trends for Advanced Packaging Technologies |
| R | Seok Seong-Ho | Corning Technology Center Korea, Korea | Corning TGV (Through Glass Via) Substrate: Innovative Solutions for Advanced Packaging |
| S | Lars Brusberg | Corning Science & Technology, Germany | Glass-Based Optical Interconnects for Co-Packaged Optics: Innovations in Coupling, Substrates, and Routing Solutions |
| T | Lee Jongho | Gwangju Institute of Science and Technology (GIST), Korea | Stretchable Inorganic LED Displays: Design and Fabrication |
| U | Park Ah-Young | University of Seoul, Korea | Analysis of Bonding Strength in Patterned Cu–SiO₂ Hybrid Interfaces |
| U | Kim Wonbin | Samsung Electronics Co., Ltd., Korea | Accelerated Reliability Evaluation and Conduction Mechanisms of Solder Resist in Fine-Pitch Substrates |
| V | Lee Sun-Ghil | Tokyo Electron Korea Ltd., Korea | Unlocking New Frontiers: Wafer-Level 3D Integration Technology for High Performance Computing and AI Applications |
| V | Kim Young-Jin | Korea Advanced Institute of Science and Technology (KAIST), Korea | Ultrafast Photonics for Ultra-Precision: New Applications in Non-Destructive Testing (NDT) |
| V | Vikram Turkani | PulseForge Inc., USA | Enabling Scalable Heterogeneous Integration with Photonic Debonding Technology |
| W | Isabella Drolz | Comet, Germany | AI Meets X-ray: The New Standard in Non-Destructive Chip-on-Wafer Inspection |
| W | Lee Bongsub | Adeia Inc., USA | Hybrid Bonding Metrology: Pre- and Post-Bond Analysis for High Yield and Throughput |
