It is our great pleasure to announce that the 21st International Symposium on Microelectronics and Packaging (ISMP 2023) will be held at Paradise Hotel Busan, Korea, on October 25(Wed.)~27(Fri.), 2023.
Youngwoo Park, CTOTokyo Electron Ltd. Title: Process and Equipment Development for Advanced Technology at Tokyo Electron Limited
Sungmin Huh, ManagerASML Korea Title: Semiconductor Scaling for the Next Generation Enabled by Lithography
Yuchul (Mike) Hwang, VP of TechnologySamsung Electronics Co., Ltd.Device Solution (Memory Division) Title: Reliability Readiness of Memory Devices for Immersion Cooling Environments
Ki-ill Moon, VPSK Hynix Inc. Title: Interconnection Technology in Memory for Generative AI Era
Yong-Kyu “YK” YoonUniversity of Florida Title: Recent Activities for Semiconductor AP/HI and Manufacturing Initiatives
Jinho LeeKorea Electronics Technology Institute Title: Review on the quality issues of immersion tin finish used in automotive electronics
CheolGi KimDaegu Gyeongbuk Institute of Science & Technology (DGIST) Title: Advances in Planar Hall Magnetoresistive Sensors for Versatile Applications: From Table to Field
SangHyun JinAmkor Technology Inc. Title: Advanced Material Solution for HDFO Package
Woosung ParkSogang University Title: Multiscale Thermal Challenges in Semiconductors: from Device to Packaging
Byoung-Ho ChoiKorea University Title: Characterizations of Transparent and Flexible ZnO-zincone Nanolaminate Thin Film Electrodes Fabricated by Atomic and Molecular Layer Depositions
Dong-Kil ShinYeungnam University Title: Technologies for Measuring the Adhesion at Interface in Electronic Package as a Function of Temperature and Humidity
Joonho YouNexensor Inc. Title: The Trend of Optical Metrologies for Heterogeneous Packaging Process
Chabum LeeTexas A&M University Title: Via Metrology and Inspection for Advanced Electronics Packaging
Youngsu KwonElectronics and Telecommunications Research Institute Title: Petaflops AI Neural Processor on Chiplet Heterogeneous Integration Package
Jiho JooElectronics and Telecommunications Research Institute Title: 94GHz Fan-Out Wafer-Level Packaging (FOWLP) for High-Resolution Proximity Sensors, Autonomous Driving, and 5G/6G Telecommunication Systems
Tomotaka TabuchDisco Corporation Title: "High-precision and Low-cost Surface Planarization Technology for Fine Pitch Cu Pillar Bump and RDL Formation"
Yoshiyuki AraiToray Engineering Co.,LTD. Title: Development Roadmap of TC Bonder Equipment with Package Evolution
Seung-Kyun KangSeoul National University Title: All-In-One Packaged 3D Bio-Electronic Printer
Jihye ShimSamsung Electronics Co., Ltd. Title: Interconnection Materials Development for Advanced Package
Youngsang ChoSamsung Electronics Co., Ltd. Title: Thermal Aware Floorplan Optimization of SoC in Mobile Phone
Mingyu LiHarbin Institute of Technology, Shenzhen Title: Die Attach Technology by Silver Nanoparticles Sintering for Power Electronics Packaging
Kyungjoon KimPukyung National University Title: Hollow Hybrid Fin Heat Sinks for Light-Weight Thermal Packaging
Yoshinori Matsuura (Canceled)Mitsui Mining & Smelting Co., Ltd. Title: Influence of Rigid Carrier Substrates & its Release Layer on Ultra Fine Pitch FO-WLPs
Thomas GlinsnerEVGroup Title: State-Of-The-Art Wafer Bonding for HBM and Heterogenous D2W 3D Integration
Fumihiro InoueYokohama National University Title: Deep Insights into Advanced Processes of Chiplet Interconnect
Taiji SakaiFujitsu Interconnect Technologies Limited Title: "Multilayer Substrate Technology with Organic/Glass Material Using Conductive Paste"
Tomoyuki HatakeyamaToyama Prefectural University Title: "International Standardization of Thermal Conductivity Measurement under High Heat Flux and High Temperature Condition"
Shinya TakyuLINTEC Corporation Title: Proposal of Expansion Process for Fan-Out WLP
Zheng ZhangOsaka University Title: Pressureless and Low-temperature Ag Paste Sinter-joining on Different Surface Metallizations for die Attachment
Hyunaee ChunKorea Institute of Industrial Technology Title: Low CTE Epoxy Materials for Advanced Semiconductor Packaging
Stanley LowEvatec AG Title: Backside Metal Films for Heat Dissipation in HPC Packages
Hidenobu DeguchiSekisui Chemical Title: Thermal Release Dielectric Film for Next Generation Fan-out Application
Lewis(In-Soo) Kangnepes Corporation Title: 5G mmWave Antenna in Package based on Fan-out RDL Interposer Technology
Daljin YoonSK Hynix Inc. Title: Effects of Metal Fixture on Temperature Cyclic (TC) Reliability Evaluation
Moritz Jurgschatsentronics metrology GmbH Title: Metrology Challenges for large Die WLP in the era of AI Accelerator HW
Hiroshi OzakiNamics Corporation Title: Non-photosensitive ultra-low Dk/Df dielectric material (m-PPE) for 5G mmWave/ 6G devices and HPC
Li MingASMPT Hong Kong Title: Advanced Fine Line Interconnect Technology for 2.5D/3D Heterogeneous Integration
Raymie VillanuevaASMPT Philippines Title: HVM Solutions for Automotive and Power Electronics
Hyun-Joong ChungUniversity of Alberta Title: Elastomers and Gels with Colorimetric Sensitivity for Value-Added Packaging for Flexible Electronics
Changsoon ChoiKorea Institute of Science and Technology (KIST) Title: Bio-inspired Electronic Eyes Using Flexible and Synaptic Optoelectronics
Min Ku KimHanyang University Title: Printed Device for Blink Detection and Electroceutical for Facial Nerve Palsy
Jae Kyung JangEO Technics Co., Ltd. Title: Application of Laser Processing Technology to 2.nD Package (Cutting, Drilling & Etc.)
Hanbit JinElectronics and Telecommunications Research Institute (ETRI) Title: Skin-attachable Electronics for On-skin Tele-haptic Applications
Kyung Min BaekSamsung Electronics Co., Ltd., Korea Title: "A Bending Test-based Framework to Evaluate Bonding Strength of Wafer-to-Wafer Direct Bonding in Chip Scale"
Yoonjoo KimKLA Corporation, Korea Title: "Inspection, Metrology, and Process Solutions for 2.5D/3D Packages in the HPC Era"
Sang-Eui LeeInha University, Korea Title: "Copper-Fullerenol Conductor as Interconnect Against Electromigration for Thermal Management in Packaging"
ChangJae ParkFuriosaAI, Inc., Korea Title: "Why is HBM and Chiplet becoming vital for AI Computing"
HeeJun JangAmkor Technology Inc., Korea Title: "S-Connect Platform(Bridge Technology) for Chiplet-based Large Module Packaging"
Rock KimSiemens EDA, Korea Title: "Siemens EDA 2.5D/ 3D IC Heterogeneous Packaging Design & Verification"
Cheol KimSamsung Electronics Co., Ltd., AVP Business Team, Korea Title: "Metal Barrier Design for Robust Advanced Packaging Interconnects"
Nam Seong KimLaserssel Corporation, Korea Title: "Overview on the Laser Selective Reflow for the High Quality AI Chip Packaging Integrating Chiplet and HBM Chips"
ISMP 2023 will include all basic/applied sciences and technologies in the fields of electronic materials, devices, and packaging. Topics may include, but are not limited to, the following areas: