It is our great pleasure to announce that the 21st International Symposium on Microelectronics and Packaging (ISMP 2023) will be held at Paradise Hotel Busan, Korea, on October 25(Wed.)~27(Fri.), 2023.
Youngwoo Park, CTO
Tokyo Electron Ltd. Title: Process and Equipment Development for Advanced Technology at Tokyo Electron LimitedSungmin Huh, Manager
ASML Korea Title: Semiconductor Scaling for the Next Generation Enabled by LithographyYuchul (Mike) Hwang, VP of Technology
Samsung Electronics Co., Ltd.Device Solution (Memory Division) Title: Reliability Readiness of Memory Devices for Immersion Cooling EnvironmentsKi-ill Moon, VP
SK Hynix Inc. Title: Interconnection Technology in Memory for Generative AI EraYong-Kyu “YK” Yoon
University of Florida Title: Recent Activities for Semiconductor AP/HI and Manufacturing InitiativesJinho Lee
Korea Electronics Technology Institute Title: Review on the quality issues of immersion tin finish used in automotive electronicsCheolGi Kim
Daegu Gyeongbuk Institute of Science & Technology (DGIST) Title: Advances in Planar Hall Magnetoresistive Sensors for Versatile Applications: From Table to FieldSangHyun Jin
Amkor Technology Inc. Title: Advanced Material Solution for HDFO PackageWoosung Park
Sogang University Title: Multiscale Thermal Challenges in Semiconductors: from Device to PackagingByoung-Ho Choi
Korea University Title: Characterizations of Transparent and Flexible ZnO-zincone Nanolaminate Thin Film Electrodes Fabricated by Atomic and Molecular Layer DepositionsDong-Kil Shin
Yeungnam University Title: Technologies for Measuring the Adhesion at Interface in Electronic Package as a Function of Temperature and HumidityJoonho You
Nexensor Inc. Title: The Trend of Optical Metrologies for Heterogeneous Packaging ProcessChabum Lee
Texas A&M University Title: Via Metrology and Inspection for Advanced Electronics PackagingYoungsu Kwon
Electronics and Telecommunications Research Institute Title: Petaflops AI Neural Processor on Chiplet Heterogeneous Integration PackageJiho Joo
Electronics and Telecommunications Research Institute Title: 94GHz Fan-Out Wafer-Level Packaging (FOWLP) for High-Resolution Proximity Sensors, Autonomous Driving, and 5G/6G Telecommunication SystemsTomotaka Tabuch
Disco Corporation Title: "High-precision and Low-cost Surface Planarization Technology for Fine Pitch Cu Pillar Bump and RDL Formation"Yoshiyuki Arai
Toray Engineering Co.,LTD. Title: Development Roadmap of TC Bonder Equipment with Package EvolutionSeung-Kyun Kang
Seoul National University Title: All-In-One Packaged 3D Bio-Electronic PrinterJihye Shim
Samsung Electronics Co., Ltd. Title: Interconnection Materials Development for Advanced PackageYoungsang Cho
Samsung Electronics Co., Ltd. Title: Thermal Aware Floorplan Optimization of SoC in Mobile PhoneMingyu Li
Harbin Institute of Technology, Shenzhen Title: Die Attach Technology by Silver Nanoparticles Sintering for Power Electronics PackagingKyungjoon Kim
Pukyung National University Title: Hollow Hybrid Fin Heat Sinks for Light-Weight Thermal PackagingYoshinori Matsuura (Canceled)
Mitsui Mining & Smelting Co., Ltd. Title: Influence of Rigid Carrier Substrates & its Release Layer on Ultra Fine Pitch FO-WLPsThomas Glinsner
EVGroup Title: State-Of-The-Art Wafer Bonding for HBM and Heterogenous D2W 3D IntegrationFumihiro Inoue
Yokohama National University Title: Deep Insights into Advanced Processes of Chiplet InterconnectTaiji Sakai
Fujitsu Interconnect Technologies Limited Title: "Multilayer Substrate Technology with Organic/Glass Material Using Conductive Paste"Tomoyuki Hatakeyama
Toyama Prefectural University Title: "International Standardization of Thermal Conductivity Measurement under High Heat Flux and High Temperature Condition"Shinya Takyu
LINTEC Corporation Title: Proposal of Expansion Process for Fan-Out WLPZheng Zhang
Osaka University Title: Pressureless and Low-temperature Ag Paste Sinter-joining on Different Surface Metallizations for die AttachmentHyunaee Chun
Korea Institute of Industrial Technology Title: Low CTE Epoxy Materials for Advanced Semiconductor PackagingStanley Low
Evatec AG Title: Backside Metal Films for Heat Dissipation in HPC PackagesHidenobu Deguchi
Sekisui Chemical Title: Thermal Release Dielectric Film for Next Generation Fan-out ApplicationLewis(In-Soo) Kang
nepes Corporation Title: 5G mmWave Antenna in Package based on Fan-out RDL Interposer TechnologyDaljin Yoon
SK Hynix Inc. Title: Effects of Metal Fixture on Temperature Cyclic (TC) Reliability EvaluationMoritz Jurgschat
sentronics metrology GmbH Title: Metrology Challenges for large Die WLP in the era of AI Accelerator HWHiroshi Ozaki
Namics Corporation Title: Non-photosensitive ultra-low Dk/Df dielectric material (m-PPE) for 5G mmWave/ 6G devices and HPCLi Ming
ASMPT Hong Kong Title: Advanced Fine Line Interconnect Technology for 2.5D/3D Heterogeneous IntegrationRaymie Villanueva
ASMPT Philippines Title: HVM Solutions for Automotive and Power ElectronicsHyun-Joong Chung
University of Alberta Title: Elastomers and Gels with Colorimetric Sensitivity for Value-Added Packaging for Flexible ElectronicsChangsoon Choi
Korea Institute of Science and Technology (KIST) Title: Bio-inspired Electronic Eyes Using Flexible and Synaptic OptoelectronicsMin Ku Kim
Hanyang University Title: Printed Device for Blink Detection and Electroceutical for Facial Nerve PalsyJae Kyung Jang
EO Technics Co., Ltd. Title: Application of Laser Processing Technology to 2.nD Package (Cutting, Drilling & Etc.)Hanbit Jin
Electronics and Telecommunications Research Institute (ETRI) Title: Skin-attachable Electronics for On-skin Tele-haptic ApplicationsKyung Min Baek
Samsung Electronics Co., Ltd., Korea Title: "A Bending Test-based Framework to Evaluate Bonding Strength of Wafer-to-Wafer Direct Bonding in Chip Scale"Yoonjoo Kim
KLA Corporation, Korea Title: "Inspection, Metrology, and Process Solutions for 2.5D/3D Packages in the HPC Era"Sang-Eui Lee
Inha University, Korea Title: "Copper-Fullerenol Conductor as Interconnect Against Electromigration for Thermal Management in Packaging"ChangJae Park
FuriosaAI, Inc., Korea Title: "Why is HBM and Chiplet becoming vital for AI Computing"HeeJun Jang
Amkor Technology Inc., Korea Title: "S-Connect Platform(Bridge Technology) for Chiplet-based Large Module Packaging"Rock Kim
Siemens EDA, Korea Title: "Siemens EDA 2.5D/ 3D IC Heterogeneous Packaging Design & Verification"Cheol Kim
Samsung Electronics Co., Ltd., AVP Business Team, Korea Title: "Metal Barrier Design for Robust Advanced Packaging Interconnects"Nam Seong Kim
Laserssel Corporation, Korea Title: "Overview on the Laser Selective Reflow for the High Quality AI Chip Packaging Integrating Chiplet and HBM Chips"ISMP 2023 will include all basic/applied sciences and technologies in the fields of electronic materials, devices, and packaging. Topics may include, but are not limited to, the following areas:
Abstract submission
Registration