Download Center
Plenary Speakers
Keynote Speakers
Invited Speakers

  • Xiaopeng Xu

    Synopsis, Inc., USAMultiscale stress and thermal modeling for 3DIC manufacturability and reliability

  • Armen Kteyan

    Siemens EDA, ArmeniaFull-chip CPI assessment for IC performance and reliability with accurate account of thermal effects

  • Stephane Moreau

    CEA, FranceTBD

  • Olivier Thomas

    IM2NP, FranceTBD (Online)

  • Jichul Kim, Master

    Samsung Electronics Co., Ltd., KoreaTBD

  • Tae Joong Kim, PL

    Samsung Electronics Co., Ltd., KoreaTBD

  • Kyojin Hwang

    Samsung Electronics Co., Ltd., KoreaNew embedding capacitor solutions for extremely large FC-BGA package platform

  • Dongwoo Han

    SK hynix Inc., KoreaTBD

  • Bioh Kim, CEO

    Yield Engineering Systems, Inc., KoreaInnovations in Various Process Technologies for Advanced Packaging

  • Eunsuk Jeon, CEO

    Laserapps, KoreaNovel singulation of glass substrate for Next generation Advanced semiconductor packaging

  • Joonho You, CEO

    nexensor Inc., KoreaTBD

  • Yoonjin Kim, CEO

    Teraon Co., Ltd., KoreaTBD

  • Myungho (Mike) Lee, COO

    TechL Co., Ltd., KoreaFlexible PCB for mmWave Antenna Application

  • Mujin Kim, CTO

    DeepSeers, KoreaIntroducing 2D vision-based packaging defect inspection for saw singulation machine

  • Jeong Won Lee

    Nepes, KoreaTBD

  • Roland Rettenmeier, Senior Manager

    Evatec AG, SwitzerlandTGV for HPC

  • TBD

    Dai Nippon Printing (DNP) Co., Ltd. , JapanTBD

  • Atsushi Okuno, CEO

    Green Planets Co., Ltd., JapanTBD

  • Kyung-Ho Park

    Korea Advanced Nano Fab Center, KoreaThe Study of the Chemical Mechanical Polishing (CMP) Parameters for Enhanced 3D Cu Hybrid Bonding

  • Seok Hwan Moon

    Electronics and Telecommunications Research Institute, KoreaOvercoming the limitations of heat dissipation technology due to high integration and thickness reduction in packaging

  • Hyunkyu Moon

    Korea Institute of Machinery and Materials, KoreaTBD

  • RYU ILL

    Seoul National University, KoreaDefect-Driven Plasticity in Microelectronics under thermal cycles

  • Hyejin Jang

    Seoul National University, KoreaThermal Transport Properties of Electronics Packaging at the Nanoscale

  • Sang Won Yoon

    Seoul National University, KoreaTBD

  • Tae-il Kim

    Sungkyunkwan University, KoreaTBD

  • Jungwan Cho

    Sungkyunkwan University, KoreaThermal property measurements using thermoreflectance techniques for device and packaging applications

  • Sunkook Kim

    Sungkyunkwan University, KoreaTBD

  • Youngsuk Nam

    Korea Advanced Institute of Science and Technology (KAIST), KoreaEnergy efficient thermal management for AI semiconductors

  • Hyun Park

    Dong-A University, KoreaMicrostructure and Elongation of Cu foil fabricated through electrodeposition for Batteries

  • Young Min Song

    Gwangju Institute of Science and Technology (GIST), KoreaBioinspired advanced camera modules for application-specific vision systems

  • Seok Kim

    Pohang University of Science and Technology (POSTECH), KoreaTransfer Printing for Micro-LED Assembly & Advanced Packaging

  • Tae Yeob Kang

    The University of Suwon, KoreaTBD

  • Tae Young Kim

    Seoul National University of Science and Technology, KoreaTBD

  • Woosung Park

    Hanyang University, KoreaTBD

  • Hyun-Sik Kim

    University of Seoul, KoreaTBD

  • Hyeok Kim

    University of Seoul, KoreaTBD

  • Tatsumi Hiroaki

    Osaka University, JapanCu Ribbon Soldering on Power Module Substrate using Blue Diode Laser

  • Chuantong Chen

    Osaka University, JapanTBD

  • Zheng Zhang

    Osaka University, JapanTBD

  • Woon Choi

    Fukuoka University, JapanTBD

  • Munho Kim

    Nanyang Technological University, SingaporeWafer bonding and single crystal nanomembrane for flexible electronics

  • Xinge Yu

    City University of Hong Kong, Hong KongEngineering of packing materials for permeable wearable electronics

  • Yunhyeok Im

    Georgia Institute of Technology, USATBD