ISMP 2025

Invited Speakers

• Jan Vardaman

  TechSearch International, Inc., USAAl Packaging Trends and Challenges

• Kim SoYoung

  Sungkyunkwan University, KoreaAI-Driven Approaches to Semiconductor Package Design

• Akane Tsukahara

  Taiyo Ink Mfg. Co., Ltd., JapanDevelopment of Low-Loss Photo-Dielectric Dry Film for Redistribution Layers in High-Speed Packaging

• Hironari Mori

  Sumitomo Bakelite Co., Ltd., JapanDevelopment of Low Temperature Curable Photosensitive Material for Redistribution Layer

• An Jinho

  Applied Materials, Inc., KoreaInnovative Solutions in Addressing the Complexity of Hybrid Copper Bonding Technology

• Wisnu Murti

  ELSPES Inc., KoreaEnabling Advanced Integration with Deep Trench Silicon Capacitors

• Takatoshi Ikeuchi

  Resonac Corporation, JapanCo-Creating the Future of Materials Innovation in Advanced Packaging

• Song Jenn-Ming

  National Chung Hsing University, TaiwanLight Enhanced Direct Metal Bonding for Advanced Electronic Assembly

• Lee Chang-Chun

  National Tsing Hua University, Taiwan Warpage Estimation and Demonstration of Panel-level Fan-out Packaging with Cu Pillars Applied on a Highly Integrated Architecture

• Wu Albert T.

  National Tsing Hua University, Taiwan Sintering Behavior and Bonding Mechanisms of Copper Nanoparticles for Advanced Electronic Packaging

• Lee Ming-Tsang

  National Tsing Hua University, Taiwan Sustainable Laser Micro/Nanofabrication for 3D Electronics: Novel Processes Development, Transport Phenomena, and Digital Twin

• Cho Wonsub

  BASF, KoreaRecent Development in Cu-Cu Hybrid Bonding: BASF's Innovations and Key Challenge

• Kasbauer Thomas

  EV Group, AustriaEnabling 3D Integration: Advanced in Hybrid Wafer Bonding Technology

• Park YongKeun

  Tomocube Inc., KoreaHolotomography: Advancing Metrology and Inspection for Microelectronics and Advanced Packaging

• Go Hamasaka

  Tokuyama Corporation, JapanHigh Thermal Conductive Aluminum Nitride Fillers for Thermal Management in Electronic Packaging

• Shiori Yamada

  ULVAC, Inc., JapanManufacturing Transformation Era: Process Solution Technologies for Panel-Level Packaging Based on Wafer-Level Quality

• Shinji Kato

  Mitsubishi Materials Corporation, Japan Introduction of Rectangle Si Panel Technology for Advanced Packaging

• Hirotaka Satori

  EBARA Corporation, Japan Integrated Systems Strategy from the Viewpoint of an Equipment Supplier in the Advanced Packaging Era

• Ryohei Oishi

  Ajinomoto Co., Inc., Japan Insulation Materials for Advanced Packaging Applications

• Yoo Sehoon

  Korea Institute of Industrial Technology (KITECH), KoreaMicrostructural and Mechanical Reliability of Fine-Pitch Interconnects Formed by LAB and TCB

• Koo BonTae

  Electronics and Telecommunications Research Institute (ETRI), KoreaEnergy-Efficient 10-Chiplet Hyperscale AI Semiconductor on Advanced Large-Scale RDL Package

• Im Yunhyeok

  Georgia Institute of Technology, USAHolistic Thermal Solution for Heterogeneously Integrated High-Power Packages

• Yi Yongsang

  LPKF Laser & Electronics Korea Ltd., KoreaDevelopment of Glass Substrates and Trend Change Using LIDE

• Jeon Eunsuk

  Laserapps Co., Ltd., KoreaMicro-Crack Free Laser Singulation and Melting TGV for Glass Substrate and Interposer

• Jung Il Hyung

  BSP Co., Ltd., KoreaTGV (Through glass via) Formation Using a Femtosecond Pulsed Laser

• Choi MiKyoung

  Amkor Technology, KoreaRobust Material Design and Development Trends for Advanced Packaging Technologies

• Seok Seong-Ho

  Corning Technology Center Korea, KoreaCorning TGV (Through Glass Via) Substrate: Innovative Solutions for Advanced Packaging

• Lars Brusberg

  Corning Science & Technology, GermanyGlass-Based Optical Interconnects for Co-Packaged Optics: Innovations in Coupling, Substrates, and Routing Solutions

• Lee Jongho

  Gwangju Institute of Science and Technology (GIST), KoreaStretchable Inorganic LED Displays: Design and Fabrication

• Park Ah-Young

  University of Seoul, KoreaAnalysis of Bonding Strength in Patterned Cu–SiO₂ Hybrid Interfaces

• Kim Wonbin

  Samsung Electronics Co., Ltd., KoreaAccelerated Reliability Evaluation and Conduction Mechanisms of Solder Resist in Fine-Pitch Substrates

• Lee Sun-Ghil

  Tokyo Electron Korea Ltd., KoreaUnlocking New Frontiers: Wafer-Level 3D Integration Technology for High Performance Computing and AI Applications

• Kim Young-Jin

  Korea Advanced Institute of Science and Technology (KAIST), KoreaUltrafast Photonics for Ultra-Precision: New Applications in Non-Destructive Testing (NDT)

• Vikram Turkani

  PulseForge Inc., USAEnabling Scalable Heterogeneous Integration with Photonic Debonding Technology

• Isabella Drolz

  Comet, GermanyAI Meets X-ray: The New Standard in Non-Destructive Chip-on-Wafer Inspection

• Lee Bongsub

  Adeia Inc., USAHybrid Bonding Metrology: Pre- and Post-Bond Analysis for High Yield and Throughput