Abstract submission
Registration
June 30, 2026
July 14, 2026
Oct 20, 2026
Nov 3-6, 2026
It is our great pleasure to announce that the 24th International Symposium on Microelectronics and Packaging (ISMP 2026) will be held at Bexco, Busan, Korea, on November 3 (Feb)~6 (Fri), 2026.
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