The semiconductor industry is at a critical inflection point, moving beyond traditional monolithic System-on-Chip (SoC) design to embrace the paradigm of chiplets. This architectural shift, championed by leaders across the industry, is not merely an evolutionary step in packaging but a revolutionary foundation for future system design, manufacturing, and economic viability. This lecture will explore the profound and multidimensional implications of the chiplet era and how/why it is being driven by AI.
Biography
Bryan Black is the CEO & Chairman of Chipletz, where he drives Chipletz’s vision, strategy, and execution. Formerly a Senior Fellow at AMD, Black was responsible for the technology developments that led to many die-stacked products including chiplets across all of AMD’s roadmaps including the design of HBM and the Fiji product that served as the foundation of today’s AI implementations. Before AMD, Black had the privilege to work at Intel where he first defined chiplets, prior to that he worked at Motorola and received his Ph.D. from Carnegie Mellon University.
Ho-Young Son, Vice President
SK hynix Inc., Korea
Title: Advanced Package Technology for HBM and Beyond HBM
Abstract
The rapid evolution of artificial intelligence (AI) and large-scale computing models has dramatically reshaped the semiconductor landscape, driving unprecedented demand for high-performance and energy-efficient memory solutions. As AI workloads increasingly rely on massive data parallelism and bandwidth-intensive operations, memory has emerged as a critical enabler of system-level performance rather than a passive component. High Bandwidth Memory (HBM) has become the cornerstone of AI and high-performance computing systems, offering superior bandwidth, reduced power consumption, and compact form factors through 3D vertical stacking and state-of-the-art advanced packaging technology. However, as AI models continue to grow exponentially in scale and complexity, conventional HBM architectures face physical and thermal limits that constrain further improvements in bandwidth, capacity, and power efficiency. To overcome these challenges, advanced packaging technologies such as 2.5D/3D integration, wafer-level redistribution layers (RDL), hybrid bonding, and chiplet-based architectures are becoming increasingly vital. In addition to HBM, as a ‘beyond HBM’ solution, we would like to introduce SK hynix’s Vertical Fan-Out (VFO) technology that enables to diverse memory application not only for on-device AI solution but also mobile storage and even computing server, where smaller form factor, better power efficiency and bandwidth must coexist.
Ho-Young Son is a VP of advanced package development of SK hynix, Korea. He received Bs.D, Ms.D, and Ph.D in materials science and engineering at Korea Advanced Institute of Science and Technology (KAIST) in Daejon, Korea in 2000, 2003, and 2008, respectively. Since he joined SK Hynix in 2008, he has led all of diverse area in the advanced packaging technology such as HBM (High bandwidth memory) and HDM (high density memory module) using the through-silicon via (TSV) technology, fan-out wafer level packaging for memory thin package as VFO (Vertical Fan-out) and heterogeneous integration for chiplet architecture, and 2.5D/3D SiP (System-in-package) package for logic-memory heterogeneous integration.
He is the most productive technologist in the memory chip stack package based on advanced packaging technology. He led the package development of HBM1 as world first HBM product and its succeeding versions like HBM2 and HBM2E. He also led 3DS (3-dimensional stacking) package for high density memory packages for 128GB and 256GB modules, and he firstly developed a mass reflow bonding process for 3DS packages in the world and expand to apply the technology to HBM2E. His recent interest is to create the value-added advanced package platform using advanced packaging technology not only for next generation HBM and memory product but heterogeneous integration system for beyond-memory solution.
