ES Jung, Ph.D., Senior Advisor
Device Solutions, Samsung Electronics Co., Ltd.
Title: Creating the Future with Semiconductor in the Smart & Connected World
The COVID-19 Pandemic has changed the way we live, and the social structure is experiencing paradigm shift, from face-to-face interactions to contactless interactions. This rapid transition is accelerating the evolution of smart & connected devices even further; which was already initiated by the 4th industrial revolution. The promising applications (automotive, AI, IoT, etc.) for smart & connected world will increase the demand of various semiconductor devices dramatically. Therefore, it is expected that the key driver of this trend will be semiconductors. However, the scaling and performance improvement of semiconductors are getting harder every year, and numerous technologies are suggested to overcome these limitations.
In this speech, I will present the current status of semiconductor development and discuss some activities that are prepared to overcome the scaling and performance limitations. As one of the key values to innovate the current semiconductors, advanced packaging technologies are getting more essential than ever. Also, I would like to emphasize the importance of the ecosystem that is needed in order to strengthen collaboration and continue the semiconductor evolution.
Keywords: semiconductor, package, innovation, ecosystem, collaboration
Dr. ES Jung is Senior Advisor of Samsung Electronics Device Solutions Division. As the previous President and CTO of Samsung Electronics Device Solutions he was in charge of Semiconductor R&D Center and Mechatronics Research Center. He was General Manager of Samsung Foundry Business, and Head of Semiconductor R&D Center, and of System LSI Manufacturing Operation Center.
Dr. Jung, as the first CTO of Samsung Electronics Device Solutions, had led research and development for the advanced processes, equipment and materials of DRAM, Flash, Logic, CIS, MRAM, etc., being in charge of Semiconductor R&D Center and Mechatronics Research Center. During his tenure as the first General Manager of Samsung Foundry, Samsung Foundry has attracted many new business opportunities and has renewed its DNA as a pure foundry, and also announced the world’s first EUV mass production and the world’s first embedded MRAM mass production. As Head of Semiconductor R&D Center, he laid the foundation for Samsung Foundry to become the leader in advanced logic and specialty process technologies, including mass production of foundry industry's first 32/28nm HKMG(high k metal gate) and 14nm FinFET, world's first mass production of 10nm FinFET as well as the world's first adoption of EUV(Extreme Ultraviolet) lithography and post FinFET GAA(Gate All Around) architecture. Moreover, through his management, Samsung's global leadership in DRAM and NAND Flash process technologies has been furthered.
He is a Vice Chairman of Cooperation in the Institute of Electronics and Information Engineers, and is a Senior Member of the National Academy of Engineering of Korea. He has been awarded the Grand Award in 2020 by The Institute of Electronics and Information Engineers, and the Silver Tower Order of Industrial Service Merit by the Korean government in 2016 for his contributions to the advancement of technology. He holds a MS in Physics from Seoul National University and a Ph.D. in Physics from the University of Texas at Arlington.
Choon Heung Lee, CTO
Jcet Group Co., Ltd.
Title: Heterogeneous Packaging for Digital Era
Digital revolution and evolution has changed the semiconductor industry of which market segments have been experiencing some degree of transformation. This transformation has been influenced by the Covid situation for last several years where personal life paradigm has been tangled with digital-centric instruments in order to continue to be socialized.
Having observed a sluggish mode in the communication market, especially in the smartphone industry of which 5G infrastructure has been dragged due to the Covid situation, and flat or negative growth in personal computing market as well, on the other hand, the high interest in AI/HPC evolution has ignited the criticality of the advanced packaging due to finer Si node complexity in cost and time-to-market perspective. Automotive with electric vehicle/autonomous trend, has shown positive growth CAGR because of more semiconductor contents in a car, where advanced packaging technology functions as in AI/HPC.
In this talk, I would like to share the market trend from which it will be discussed what OSATs should do in terms of packaging technologies and various market segments.
Dr. Lee Choon Heung joined the company(JCET) as Chief Technology Officer on May 17, 2019. Prior to joining JCET, Dr. Lee served as Chief Technology Officer and Executive Vice President for Worldwide Manufacturing Operations at Amkor Technology, and of President of Amkor Korea. Dr. Lee holds a master's degree in Solid State Physics and a Ph.D. in Theoretical Solid State Physics from Case Western Reserve University. He has authored numerous research papers on various packaging technology-related subjects and has been granted 38 patents in Korea and 21 in the US.