Committee
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General Chair
- Sayoon Kang (The Korean Microelectronics and Packaging Society)
International Advisory Committee
- Chair:
Taek-Soo Kim (Korea Advanced Institute of Science and Technology)
- Jaeho Lee (Hongik University)
- Gu-Sung Kim (Kangnam University)
- Seok Joon Kwon (Sungkyunkwan University)
- Woosung Park (Sogang University)
- Yei Hwan Jung (Hanyang University)
- Ehrenfried Zschech (Brandenburg University of Technology)
- Olivier Thomas (Aix-Marseille University)
- Reinhold Dauskardt (Stanford University)
- Valeriy Sukharev (Siemens EDA)
- Zhong Chen (Nanyang Technological University (NTU))
Academia-Industry Cooperation Committee
- Young Jae Kim (Daeduck Electronics Co., Ltd.)
- Min Hyun Kim (Hanmi Semiconductor Co., Ltd.)
- Nam Gi Kang (Korea Electronics Technology Institute)
- Jong Tae Moon (Hojun Able Co.)
- Hyuk Lee (Flex Com Co.)
- Xiaopeng Xu (Synopsis, Inc.)
Program Committee
- Chair:
Yoonchul Sohn (Chosun University)
- Co-chair:
Yong-Ho Ko (Korea Institute of Industrial Technology)
Daeil Kwon (Sungkyunkwan University)
Tae-il Kim (Sungkyunkwan University)
- Soomin Kang (Seoul National University of Science and Technology)
- In Soo Kang (Nepes corporation)
- Dong Jin Kim (Korea Institute of Industrial Technology)
- Young Cheon Kim (Andong National University)
- Jae Choon Kim (Samsung Electronics)
- Hyeong Jae Kim (Korea Institute of Industrial Technology)
- Seunghoon Nam (Myongji University)
- Seong Jin Park (ASMPT)
- Ah-Young Park (Korea Institute of Machinery & Materials)
- Tae-Youl Yang (Chungnam National University)
- Hanwool Yeon (Gwangju Institute of Science and Technology)
- So Yeon Lee (Kumoh National Institute of Technology)
- Seung Hwan Lee (Hanyang University)
- Hakjun Lee (Korea Institute of Industrial Technology)
- Hyuk Lee (Hoseo University)
- Jiho Joo (Electronics and Telecommunications Research Institute)
- Tae-Je Cho (Daegu Gyeongbuk Institute of Science & Technology)
- Minseok Seo (Camtek Korea Ltd.)
- Hak-Sung Kim (Hanyang University)
- Yong-Nam Ko (Hana Micron Inc.)
- Jae Hak Lee (Korea Institute of Machinery & Materials)
- Jeongho Cho (Hanwha Precision Machinery Co., Ltd.)
- Changhwan Choi (Hanyang University)
- Junghwan Bang (Korea Institute of Industrial Technology)
- Jiyong Park (Korea Institute of Industrial Technology)
- Kyung Min Kim (Tech University of Korea)
- Jonghoon Kim (EMC Doctors Inc.)
- Joon Ho You (Nexensor Inc.)
- Kunmo Chu (Samsung Advanced Institute of Technology)
- Ju-Young Kim (Ulsan National Institute of Science and Technology (UNIST))
- Youngsuk Nam (Korea Advanced Institute of Science and Technology)
- Joon Sang Kang (Korea Advanced Institute of Science and Technology)
- Ki Jin Han (Dongguk University)
- Jimin Kwon (Ulsan National Institute of Science and Technology (UNIST))
- Yeon Hee Kim (Hoseo University)
- Hyun-Sik Kim (University of Seoul)
- Seung Jin Oh (Korea Institute of Machinery & Materials)
- Jungwan Cho (Sungkyunkwan University)
General Affairs Committee
- Young-Bae Park (Andong National University)
- Sehoon Yoo (Korea Institute of Industrial Technology)
Publication Committee
- Chair:
Hyung-Ho Park (Yonsei University)
- Co-chair:
Jeong-Won Yoon (Chungbuk National University)
Jun Seok Ha (Chonnam National University)
- Jong-Hyun Lee (Seoul National University of Science and Technology)
- Kyu Hyoung Lee (Yonsei University)
- Eun-Ho Lee (Sungkyunkwan University)
- Min-Su Kim (Korea Institute of Industrial Technology)
- Bong Young Yoo (Hanyang University)
- Jong Kyung Park (Seoul National University of Science and Technology)
- Hongyun So (Hanyang University)
- Yong-Seok Lee (Myongji University)
- Seunghoe Choe (Tech University of Korea)
Financial Committee
- Chair:
Sungdong Kim (Seoul National University of Science and Technology)
- Co-chair:
Dong Cheol Lee (Hana Micron Inc.)
- SungSoon Park (Intel Korea)
- Se Young Jeong (Ntrium inc.)
- Keejun Han (Hansung University)
Local Organization Committee
- Chair:
Myungyung Jeong (Pusan National University)
- Co-chair:
Suck Won Hong (Pusan National University)
Secretariat
- Minjin Kim (The Korean Microelectronics and Packaging Society)