ISMP 2025 is the 23rd International Symposium on Microelectronics and Packaging. The ISMP organized by KMEPS (The Korean Microelectronics and Packaging Society) presents a valuable chance to share the latest electronic packaging technologies including novel packaging technologies, packaging materials, process, equipment, design, reliability and so on.
The ISMP 2025 organizing committee promises to provide an outstanding and fruitful program, which will be a great opportunity that you do not miss. We cordially invite you to submit abstracts for oral and poster presentation. This year, the conference is held to provide a bigger chance to exchange ideas and experiences from November 4 (Tue)~7 (Fri), 2025 at Bareumi Hotel Inter-Burgo Daegu, Daegu Metropolitan City, Korea. As the conference site, Daegu is the largest city in Korea and famous for tourist and shopping attractions as well as its astounding variety of food. You will not forget the vibrant marketplace experience and the exceptional hospitality of Daegu.
We look forward to seeing you in Daegu at the ISMP 2025.
| Title | The 23rd International Symposium on Microelectronics and Packaging | ||||||||
|---|---|---|---|---|---|---|---|---|---|
| Event Type | Onsite face-to-face Symposium | ||||||||
| Date | November 4(Tue) ~ 7(Fri), 2025 | ||||||||
| Venue | Bareumi Hotel Inter-Burgo Daegu, Daegu Metropolitan City, South of Korea | ||||||||
| Host | Korea Microelectronics and Package Society | ||||||||
| Program | Welcome Reception, Plenary/ Keynote/ Invited/ Oral/ Poster Presentation and Banquet Etc. | ||||||||
| Website | ismp.or.kr | ||||||||
| Offcial Language | English | ||||||||
| Key Dates |
|
||||||||
| Secretariat | KMEPS (The Korean Microelectronics and Packaging Society) Rm. 815, The Korea Science Technology Center The first building, 22, Teheran-ro 7 Gil, Gangnam-gu, Seoul 06130, Republic of Korea Tel.: +82-2-538-0962 E-mail : secretary@ismp.or.kr |