ISMP 2026 is the 24th International Symposium on Microelectronics and Packaging. The ISMP organized by KMEPS (Korean MicroElectronics Packaging Society) presents a valuable chance to share the latest electronic packaging technologies including novel packaging technologies, packaging materials, process, equipment, design, reliability and so on.
The ISMP 2026 organizing committee promises to provide an outstanding and fruitful program, which will be a great opportunity that you do not miss. We cordially invite you to submit abstracts for oral and poster presentation. This year, the conference being held to provide a bigger chance to exchange ideas and experiences from November 3 (Tue)~6 (Fri), 2026 at Bexco Exhibition Center 2, Busan, Korea. As the conference site, Busan is the second-largest city in Korea and famous for tourist and shopping attractions as well as its astounding variety of fresh seafood. You will not forget the vibrant marketplace experience and the exceptional hospitality of Busan.
We look forward to seeing you in Busan at the ISMP 2026.
| Title | The 24th International Symposium on Microelectronics and Packaging | ||||||||
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| Event Type | Onsite face-to-face Symposium | ||||||||
| Date | November 3(Tue) ~ 6(Fri), 2026 | ||||||||
| Venue | BEXCO Exhibition Center 2, Busan, South of Korea | ||||||||
| Host | Korea Microelectronics and Package Society | ||||||||
| Program | Welcome Reception, Plenary/ Keynote/ Invited/ Oral/ Poster Presentation and Banquet Etc. | ||||||||
| Website | ismp.or.kr | ||||||||
| Offcial Language | English | ||||||||
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| Secretariat | KMEPS (Korean MicroElectronics Packaging Society) Rm. 815, Korea Science and Technology Bldg., 22, Teheran-ro 7-gil, Gangnam-gu, Seoul 06130, Republic of Korea Tel.: +82-2-538-0962~4 E-mail : secretary@ismp.or.kr |