ISMP 2023 is the 21st International Symposium on Microelectronics and Packaging. ISMP is the top-tier international event that brings together the expertise in electronics packaging and microelectronic systems from academia to industry. This year, the conference is held to provide a bigger chance to exchange ideas and experiences from October 25(Wed.) ~ 27(Fri.), 2023 at Paradise Hotel, Busan, Korea. As the conference site, Busan is the second-largest city in Korea and famous for tourist and shopping attractions as well as its astounding variety of fresh seafood. You will not forget the vibrant marketplace experience and the exceptional hospitality of Busan.

We look forward to seeing you in Busan at the ISMP 2023.

Title The 21st International Symposium on Microelectronics and Packaging
Event Type Onsite face-to-face Symposium
Date October 25(Wed.) ~ 27(Fri.), 2023
Venue Paradise Hotel, Busan, Korea
Host Korea Microelectronics and Package Society
Program Welcome Reception, Plenary/ Keynote/ Invited/ Oral/ Poster Presentation and Banquet
Offcial Language English
Key Dates
Abstract submission August 4, 2023
Acceptance notification August 18, 2023
Pre-registration Deadline October 20, 2023
Symposium October 25~27, 2023
Secretariat KMEPS (Korea Microelectronics and Packaging Society)
Rm. 815, Korea Science and Technology Bldg., 22, Teheran-ro 7-gil, Gangnam-gu, Seoul 06130, Republic of Korea
Tel.: +82-2-538-0962
E-mail :