ISMP 2023

ISMP-IRSP 2024 is the 22^nd International Symposium on Microelectronics and Packaging joined with the 18th International Conference Reliability and Stress-Related Phenomena in Nanoelectronics. The ISMP organized by KMEPS (The Korean Microelectronics and Packaging Society) presents a valuable chance to share the latest electronic packaging technologies and IRSP discusses coupled electro-thermal-mechanical complexities in materials, devices, circuits, packages, and systems that crucially affect the design and technology of electronics.

The ISMP-IRSP 2024 organizing committee promises to provide an outstanding and fruitful program, which will be a great opportunity that you do not miss. We cordially invite you to submit abstracts for oral and poster presentation. This year, the conference is held to provide a bigger chance to exchange ideas and experiences from November 6(Wed) ~ 8(Fri), 2024 at Paradise Hotel, Busan, Korea. As the conference site, Busan is the second-largest city in Korea and famous for tourist and shopping attractions as well as its astounding variety of fresh seafood. You will not forget the vibrant marketplace experience and the exceptional hospitality of Busan.

We look forward to seeing you in Busan at the ISMP-IRSP 2024.