| Oct. 25, 2023 (Wed.) | ||||||
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| Grand Ballroom A (200) | Grand Ballroom B (100) | Capri (120) | Sydney (70) | Venice (32) | Miami (32) | |
| Advanced Packaging Process 1 | Flexible, Wearable, and Printed Electronics | Measurement and Characterization 1 | Hanyang Semiconductor Packaging Center | Special Session 1 (closed Session) | Special Session 2 (closed Session) | |
| Session Chair | Hyo-Jong Lee | Tae-il Kim | Hanwool Yeon | Hak-Sung Kim | Jung-Hwan Bang | Hakjun Lee |
| 13:00 ~ 13:25 | Seungman Kim, Korea Institute Machinery and Materials (KIMM), Korea "Micro-Chip Transfer Technology Using fs Pulse Laser" |
●(Invited) Hyun-Joong Chung, University of Alberta, Canada (Online) "Elastomers and Gels with Colorimetric Sensitivity for Value-Added Packaging for Flexible Electronics" | ●(Invited) Hanbit Jin, Electronics and Telecommunications Research Institute (ETRI), Korea "Skin-attachable Electronics for On-skin Tele-haptic Applications" |
Joo Young Pyun, Hanyang University, Korea "Redistribution Layer Process for Large Substrate" |
"Implementation of Reliable FPCB Module with High Peel Strength for the Integration of Battery Sensing Assembly in Electric Vehicle" Corea Electronics Co., Ltd EDUEN Co., Ltd Korea Institute of Industrial Technology (KITECH) Kyonggi University Konkuk University (closed Session) |
"Development of Bonding/ Debonding Equipment and Adhesive Commercialization Technology for Handling Ultra-thin Wafers for HBM Manufacturing" Korea Institute of Industrial Technology (KITECH) Zeus Co., Ltd. SK Inc. Materials Korea Institute Machinery and Materials (KIMM) O-Flex Co., Ltd. Chosun University (closed Session) |
| 13:25 ~ 13:50 | Hisashi Ogasawara, Toray Industries Inc., Japan "Low-Temperature Curable Polyimide having Low Dk & Df for Redistribution Layer" |
●(Invited) Changsoon Choi, Korea Institute of Science and Technology (KIST), Korea "Bio-inspired Electronic Eyes Using Flexible and Synaptic Optoelectronics" |
Changsoon Choi, Dongguk University, Korea "Mechano-Electrochemical Energy Harvesting for Wearable Strain Sensors" |
Changhwan Choi, Hanyang University, Korea "Development of RDL Unit Process through FEOL Photolithography" |
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| 13:50 ~ 14:15 | Chang Oh, Jcet Group Co., Ltd., Korea "Characterization of Ag Particle/ Particle Free Ink Spray-coated on System-in-package for EMI Shielding" |
●(Invited) Min Ku Kim, Hanyang University, Korea "Printed Device for Blink Detection and Electroceutical for Facial Nerve Palsy" |
●(Invited) CheolGi Kim, Daegu Gyeongbuk Institute of Science & Technology (DGIST), Korea "Advances in Planar Hall Magnetoresistive Sensors for Versatile Applications: From Table to Field" |
Sangyeun Park, Hanyang University, Korea "Control of Electroplated Cu Trace for Advanced Fine Pitch RDL" |
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| 14:15 ~ 14: 40 | ●(Invited) Hiroshi Ozaki, Namics Corporation, Japan "Non-photosensitive Ultra-low Dk/Df Dielectric Material (m-PPE) for 5G mmWave/ 6G Devices and HPC" |
●(Invited) Seung-Kyun Kang, Seoul National University, Korea "All-In-One Packaged 3D Bio-Electronic Printer" |
●(Invited) Kyung Min Baek, Samsung Electronics Co., Ltd., Korea "A Bending Test-based Framework to Evaluate Bonding Strength of Wafer-to-Wafer Direct Bonding in Chip Scale" |
Junhong Park, Hanyang University, Korea "Effective Vibration Reduction Technology with Meta Structures for Smart Factory" |
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| 14:40 ~ 15:00 | Break Time | |||||
| Session Chair | Sungdong Kim | |||||
| 15:00 ~ 15:30 | Keynote Talk 1 - Ki-ill Moon / SK Hynix Inc., Korea Interconnection Technology in Memory for Generative AI Era (Grand Ballroom) |
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| 15:30 ~ 16:00 | Keynote Talk 2 - Yuchul (Mike) Hwang / Samsung Electronics Co., Ltd., Korea Reliability Readiness of Memory Devices for Immersion Cooling Environments (Grand Ballroom) |
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| 16:00 ~ 16:20 | Break Time | |||||
| Grand Ballroom A (200) | Grand Ballroom B (100) | Capri (120) | Sydney (70) | Venice (32) | Miami (32) | |
| Packaging Equipment | PCB, Solder, and Assembly 1 | Measurement and Characterization 2 | Hanyang Semiconductor Packaging Center | Special Session 3 (closed Session) | Special Session 4 (closed Session) | |
| Session Chair | Ah-Young Park | Tae-Youl Yang | Jiyong Park | Hak-Sung Kim | Kwang-Seong Choi | Taek-Soo Kim |
| 16:20 ~ 16:45 | Nam Son Park, Tech University of Korea, Korea "Development Trends of Plasma System and Applications in Advanced Packaging" |
●(Invited) Jinho Lee, Korea Electronics Technology Institute (KETI), Korea "Review on the Quality Issues of Immersion Tin Finish Used in Automotive Electronics" |
●(Invited) Moritz Jurgschat, sentronics metrology GmbH, Germany "Metrology Challenges for large Die WLP in the era of AI Accelerator HW" |
Min Ku Kim, Hanyang University, Korea "Slurry Sensing during CMP Process" |
Electronics and Telecommunications Research Institute (ETRI) Korea Advanced Institute of Science and Technology (KAIST) SK Hynix Inc. Chosun University (closed Session) |
"High-reliability Silicon Bridge Heterogeneous Packaging Technology for High-efficiency Power Distribution" Korea Advanced Institute of Science and Technology (KAIST) Seoul National University of Science and Technology Sungkyunkwan University Seoul National University Andong National University HANA Micron Inc. (closed Session) |
| 16:45 ~ 17:10 | ●(Invited) Stanley Low, Evatec AG, Swiss "Backside Metal Films for Heat Dissipation in HPC Packages" |
●(Invited) Yong-Kyu “YK” Yoon, Florida University, USA (Online) "Recent Activities for Semiconductor AP/HI and Manufacturing Initiatives" | ●(Invited) Joonho You, Nexensor Inc., Korea "The Trend of Optical Metrologies for Heterogeneous Packaging Process" |
Jaemyung Lim, Hanyang University, Korea "Thermal Modeling for Chiplet Package" |
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| 17:10 ~ 17:35 | ●(Invited) Tomotaka Tabuchi, Disco Corporation, Japan "High-precision and Low-cost Surface Planarization Technology for Fine Pitch Cu Pillar Bump and RDL Formation" |
Shuye Zhang, Harbin Institute of Technology (HIT), China "Effect of Ga on The Microstructure Evolution and Mechanical Properties Variation of Cu/SnBiIn-xGa solder joints during Isothermal Aging Process" |
●(Invited) Chabum Lee, Texas A&M University, USA "Via Metrology and Inspection for Advanced Electronics Packaging" |
Hak-Sung Kim, Hanyang University, Korea "Electro-Thermal-Mechanical RDL Design and Reliability Evaluation for 2.1D Package" |
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| 17:35 ~ 18:00 | ●(Invited) Yoshiyuki Arai, Toray Engineering Co., Ltd., Japan "Development Roadmap of TC Bonder Equipment with Package Evolution" |
●(Invited) Yoshinori Matsuura, Mitsui Mining & Smelting Co., Ltd., Japan (Canceled) "Influence of Rigid Carrier Substrates & its Release Layer on Ultra Fine Pitch FO-WLPs" |
●(Invited) Yoonjoo Kim, KLA Corporation, Korea "Inspection, Metrology, and Process Solutions for 2.5D/3D Packages in the HPC Era" |
Dukyong Kim, Hanyang University, Korea "Laser Spallation Test for Measurement of the Interfacial Adhesion of Thin Films" |
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| 18:00 ~ 18:25 | Break Time | Sang Won Yoon, Hanyang University, Korea "Multi-Physics Analysis considering Electrical and Thermal Properties of Power Module used in Automotive and Industrial Applications" |
Break Time | |||
| 18:25 ~ 19:00 | Break Time | |||||
| 19:00 ~ 21:00 | Sponsor Night and Lucky Draw (Grand Ballroom) ※ This event is open to all registrants. |
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| Oct. 26, 2023 (Thu.) | ||||||
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| Grand Ballroom A (200) | Grand Ballroom B (100) | Capri (120) | Sydney (70) | Venice (32) | Miami (32) | |
| Novel Packaging Technologies | Package Design and Modeling 1 | Reliability of Electronic Components 1 | Chiplet Advanced Packaging | Poster Session | Poster Session | |
| Session Chair | Sumin Kang | Joon Sang Kang | Hak-Sung Kim | Youngsu Kwon | Ah-Young Park | Tae-Youl Yang |
| 9:00 ~ 9:25 | Eunseok Seo, Crefle Inc., Korea "Anomaly Detection-Based AI Vision Technology for Semiconductor Package Inspection Applications" |
Yoonseok Han, Hanwha Precision Machinery, Korea "Flip-Chip Bonder Design with High Though, High Performance and Cost Effective" |
●(Invited) Daljin Yoon, SK Hynix Inc., Korea "Effects of Metal Fixture on Temperature Cyclic (TC) Reliability Evaluation" |
● 9:00 ~ 9:20 (Invited) ChangJae Park, FuriosaAI, Inc., Korea "Why is HBM/Chiplet becoming vital for AI Computing" |
Poster Session I | Poster Session II |
| 9:25 ~ 9:50 | ●(Invited) Jae Kyung Jang, EO Technics Co., Ltd., Korea "Application of Laser Processing Technology to 2.nD Package (Cutting, Drilling & Etc.)" |
●(Invited) Youngsang Cho, Samsung Electronics Co., Ltd., Korea "Thermal Aware Floorplan Optimization of SoC in Mobile Phone" |
●(Invited) Woosung Park, Sogang University, Korea "Multiscale Thermal Challenges in Semiconductors: from Device to Packaging" |
● 9:20 ~ 9:40 (Invited) HeeJun Jang, Amkor Technology Inc., Korea "S-Connect Platform(Bridge Technology) for Chiplet-based Large Module Packaging" |
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| 9:50 ~ 10:15 | ●(Invited) Thomas Glinsner, EV Group, Austria "State-Of-The-Art Wafer Bonding for HBM and Heterogenous D2W 3D Integration" |
●(Invited) Kyoung Joon Kim, Pukyung National University, Korea "Hollow Hybrid Fin Heat Sinks for Light-Weight Thermal Packaging" |
●(Invited) Byoung-Ho Choi, Korea University, Korea "Characterizations of Transparent and Flexible ZnO-zincone Nanolaminate Thin Film Electrodes Fabricated by Atomic and Molecular Layer Depositions" |
● 9:40 ~ 10:00 (Invited) Rock Kim, Siemens EDA, Korea "Siemens EDA 2.5D/ 3D IC Heterogeneous Packaging Design & Verification" |
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| 10:15 ~ 10:40 | ●(Invited) Li Ming, ASMPT, Hong Kong "Advanced Fine Line Interconnect Technology for 2.5D/3D Heterogeneous Integration" | Kun-Lin Lin, Taiwan Semiconductor Research Institute, Taiwan "High Heat Dissipation Ceramic Substrates for High Power Electronics" |
●(Invited) Dong-Kil Shin, Yeungnam University, Korea "Technologies for Measuring the Adhesion at Interface in Electronic Package as a Function of Temperature and Humidity" |
● 10:00 ~ 10:20 (Invited) Cheol Kim, Samsung Electronics Co., Ltd., AVP Business Team, Korea "Metal Barrier Design for Robust Advanced Packaging Interconnects" |
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| 10:40 ~ 10:55 | Break Time | ● 10:20 ~ 10:40 (Invited) Nam Seong Kim, Laserssel Co., Ltd., Korea "Overview on the Laser Selective Reflow for the High Quality AI Chip Packaging Integrating Chiplet and HBM Chips" |
Break Time | |||
| 10:55 ~ 11:10 | Opening Remark - Sayoon Kang / KMEPS (Grand Ballroom) | |||||
| Session Chair | Yoonchul Sohn | |||||
| 11:10~11:40 | Plenary Talk 1 - ES Jung / Samsung Electronics Co., Ltd., Korea Creating the Future with Semiconductor in the Smart & Connected World (Grand Ballroom) |
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| 11:40 ~ 12:10 | Plenary Talk 2 - Choon Heung Lee / JCET Group Co., Ltd., China Heterogeneous Packaging for Digital Era (Grand Ballroom) |
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| 12:10 ~ 13:10 | Lunch | |||||
| Session Chair | Ah-Young Park & Tae-Youl Yang | |||||
| 13:10 ~ 14:00 | Poster Presentation I, II (Venice & Miami) | |||||
| Session Chair | Sehoon Yoo | |||||
| 14:00 ~ 14:30 | Keynote Talk 3 - Youngwoo Park / TEL(Tokyo Electron) Korea, Korea Process and Equipment Development for Advanced Technology at Tokyo Electron Limited (Grand Ballroom) |
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| 14:30 ~ 15:00 | Keynote Talk 4 - Sungmin Huh / ASML Korea, Korea Semiconductor Scaling for the Next Generation Enabled by Lithography (Grand Ballroom) |
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| 15:00 ~ 15:20 | Break Time | |||||
| Grand Ballroom A (200) | Grand Ballroom B (100) | Capri (120) | Sydney (70) | Venice (32) | Miami (32) | |
| Materials for Interconnects and Packaging | Automotive & Power Electronic Packaging | Package Design and Modeling 2 | ICEP Session | Poster Session | Poster Session | |
| Session Chair | Kwangjoo Lee | Min-Su Kim | Jonghoon Kim | Taek-Soo Kim | Ah-Young Park | Tae-Youl Yang |
| 15:20 ~ 15:45 | ●(Invited) Jihye Shim, Samsung Electronics Co., Ltd., Korea "Interconnection Materials Development for Advanced Package" |
●(Invited) Raymie Villanueva, ASMPT, Philippines "HVM Solutions for Automotive and Power Electronics" |
●(Invited) Sang-Eui Lee, Inha University, Korea "Copper-Fullerenol Conductor as Interconnect Against Electromigration for Thermal Management in Packaging" |
●(Invited) Fumihiro Inoue, Yokohama National University, Japan "Deep Insights into Advanced Processes of Chiplet Interconnect" |
Poster Session I | Poster Session II |
| 15:45 ~ 16:10 | ●(Invited) SangHyun Jin, Amkor Technology Inc., Korea "Advanced Material Solution for HDFO Package" |
●(Invited) Zheng Zhang, Osaka University, Japan "Pressureless and Low-temperature Ag Paste Sinter-joining on Different Surface Metallizations for Die Attachment" |
●(Invited) Youngsu Kwon, Electronics and Telecommunications Research Institute (ETRI), Korea "Petaflops AI Neural Processor on Chiplet Heterogeneous Integration Package" |
●(Invited) Taiji Sakai, Fujitsu Interconnect Technologies Limited, Japan "Multilayer Substrate Technology with Organic/Glass Material Using Conductive Paste" |
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| 16:10 ~ 16:35 | ●(Invited) Hyunaee Chun, Korea Institute of Industrial Technology (KITECH), Korea "Low CTE Epoxy Materials for Advanced Semiconductor Packaging" |
●(Invited) Mingyu Li, Harbin Institute of Technology (HIT), China "Die Attach Technology by Silver Nanoparticles Sintering for Power Electronics Packaging" |
●(Invited) Jiho Joo, Electronics and Telecommunications Research Institute (ETRI), Korea "94GHz Fan-Out Wafer-Level Packaging (FOWLP) for High-Resolution Proximity Sensors, Autonomous Driving, and 5G/6G Telecommunication Systems" |
●(Invited) Tomoyuki Hatakeyama, Toyama Prefectural University, Japan (Online Q&A) "International Standardization of Thermal Conductivity Measurement under High Heat Flux and High Temperature Condition" | ||
| 16:35 ~ 17:00 | ●(Invited) Hidenobu Deguchi, Sekisui Chemical, Japan "Thermal Release Dielectric Film for Next Generation Fan-out Application" |
Suhan Lim, Hansung University, Korea "DeepSeers: Developing User-friendly Machine Vision Solution for Detecting Various Defects from a Packaging Machine" |
●(Invited) Lewis(In-Soo) Kang, Nepes Corporation, Korea "5G mmWave Antenna in Package based on Fan-out RDL Interposer Technology" |
●(Invited) Shinya Takyu, LINTEC Corporation, Japan "Proposal of Expansion Process for Fan-Out WLP" |
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| 17:05 ~ 17:35 | General Meeting (Sydney) | |||||
| 18:00 ~ 20:00 | Banquet and Headong Award Ceremony (Grand Ballroom) | |||||
※ This event is open to all registrants.
| Oct. 27, 2023 (Fri.) | ||||||
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| Grand Ballroom A (200) | Grand Ballroom B (100) | Capri (120) | Sydney (70) | Venice (32) | Miami (32) | |
| Advanced Packaging Process 2 | Reliability of Electronic Components 2 | Measurement and Characterization 3 | Special Session 5 (closed Session) | Special Session 6 (closed Session) | PCB, Solder, and Assembly 2 | |
| Session Chair | Yun Sung Woo | Seung-Kyun Kang | Tae-Ik Lee | Sung Yong Kim | Sehoon Yoo | Kwang-Seok Kim |
| 9:00 ~ 9:20 | Injoo Kim, Seoul National University of Science and Technology, Korea "The Role of Surface Modification in Cu/SiO2 Hybrid Bonding" |
Kyeongsoo Kim, Andong National University, Korea, "Mixed Loading Effects of Electromigration and Thermal Cycling on the Interfacial Reaction Characteristics in Cu/Sn-1.8Ag Microbumps" |
Jaehyun Park, Korea Institute of Industrial Technology (KITECH), Korea "A Study of Control Algorithm Comparison for Active Vibration Isolation System" |
"Cases of Studying Enterprise Support Based on Engineering Simuation" Tech University of Korea Etc. (closed Session) |
"Development of Next-generation Surface Treatment Technology with mmWave High Frequency Response and 15 μm Wiring Pitch for System Semiconductor Packages" Korea Institute of Industrial Technology (KITECH) MK Chem & Tech Co., Ltd. Simmtech Co., Ltd. Tech University of Korea (closed Session) |
Daeyoon Jeong, Andong National University, Korea "Self-forming Barrier Effect on the Interfacial Adhesion Characteristics between ALD Ru and ZnO Thin Films" |
| 9:20 ~ 9:40 | Seok-Hoon Jeong, Hanyang University, Korea "Study on the Photonic Sintering Process of BaTiO3 Nanoparticles with Added Graphene for the Implementation of Dielectric Constant" |
You-Gwon Kim, Hanyang University, Korea "Effect of Solder Composition on Fatigue Life in Repeated Thermal Cycling of Printed Circuit Boards" |
Tae-Wan Kim, Hanyang University, Korea "Deep Learning-based Terahertz Inspection Technique for Internal Defect Detection in Ceramic, Polymer, and Metal Composites Used in Semiconductor Manufacturing Process" |
Eunjin Jo, Korea Institute of Industrial Technology (KITECH), Korea "Laser Soldering and Reflow Soldering Interconnected Al FPCB/Cu FPCB Lap Joints for Use in Battery Applications: SAC305 vs. Sn-57Bi-1Ag Solder Materials" |
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| 9:40 ~ 10:00 | Jahyeon Kim, Korea Institute of Industrial Technology (KITECH), Korea "Evaluations on Interfacial Properties of Pb-free Solder Joints with Sn-Bi-Ag and Sn-Ag-Cu during Isothermal Aging" |
Dong Ik Jeong, Andong National University, Korea "Post-annealing Effects on the Interfacial Reaction and Mechanical Reliability of Cu/Sn-3.0Ag-0.5Cu/Al Joint for Heat Dissipation Module" |
Myoung Song, Korea Advanced Institute of Science and Technology (KAIST), Korea "Prediction of Wiggling Phenomenon in High Aspect Ratio Thin Film Structure During Etching Process through Buckling-Based Dimensional Analysis" |
Min Sang Ju, Korea Advanced Institute of Science and Technology (KAIST), Korea "Thermo-Mechanical Behavior of Molded Underfill Filling the Sub-100μm Die Gap for Advanced Packaging" |
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| 10:00 ~ 10:20 | Seongjong Shin, Korea Advanced Institute of Science and Technology (KAIST), Korea "Porous Liquid Metal-based Phase Change Materials with Suppressed Supercooling for Sustainable Thermal Regulation of Electronic Devices" |
Hyejin Kim, Andong National University, Korea "Annealing Effect on the Interfacial Reaction and Mechanical Reliability of Non-cyanide Gold Bump for Display IC Bonding" |
Seong Hwan Park, Sungkyunkwan University, Korea "Development of a Package Warpage Prediction Model Considering CureDependent Viscoelastic Material Properties for Mold Underfill" |
Yehri Kim, Korea Institute of Industrial Technology (KITECH), Korea "Mechanical Performance of Ag Sintered Die-Attach Structures with Pre-Hillock Generated Ag Plating Surface" |
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| 10:20 ~ 10:40 | Seung Jin Oh, Korea Advanced Institute of Science and Technology (KAIST), Korea "Elucidating the Mechanical Properties of Transparent Conductive Thin Films for Mechanically Reliable Microelectronics Applications" |
Seoah Kim, Korea Institute of Industrial Technology (KITECH), Korea "Microstructural Evolution and High-temperature Reliability of Ag Sintered Die-attach on ENIG Finishes for Application in the In-wheel Motor" |
Seungwoo Kim, Korea Advanced Institute of Science and Technology (KAIST), Korea "Thermal Management in EV Inverters: Optimizing Jet Impingement Cooling with Micropost Integration" |
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| 10:40 ~ 11:00 | Break Time | |||||
| Grand Ballroom A (200) | Grand Ballroom B (100) | Capri (120) | Sydney (70) | Venice (32) | Miami (32) | |
| Young Engineers Forum | Special Session 7 (closed Session) | Special Session 5 (closed Session) | Special Session 8 (closed Session) | Special Session 9 (closed Session) | ||
| Session Chair | Seung-Boo Jung | Sung Yong Kim | Hee Chul Lee | Hakjun Lee | ||
| 11:00 ~ 12:30 | Young Engineers Forum - Sayoon Kang / KMEPS, Korea "성과와 성장을 잘 하는 사람들의 특징" (Korean Language Session) |
"Element Technology for Low-carbon Packaging Application" Sungkyunkwan University Chosun University Chungbuk National University Kyung Hee University Hanyang University Korea Institute of Industrial Technology (KITECH) Daeduck Electronics Co.,Ltd. LB Semicon Co., Ltd. Pstec Co., Ltd. (closed Session) |
"Cases of Studying Enterprise Support Based on Engineering Simuation" Tech University of Korea Etc. (closed Session) |
"Establishing PCB Evaluation Infrastructure for Quality Innovation and Supply Safety" Tech University of Korea Korea Electronics Technology Institute (KETI) Korea Institute of Industrial Technology (KITECH) Korea Electronics Packaging and Circuit Association (closed Session) |
"Micro Semiconductor Socket for Highly Integrated Semiconductor Inspection" TSE Co., Ltd. Humott Ltd. Korea Institute of Industrial Technology (KITECH) Tech University of Korea (closed Session) |
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| 12:30 ~ 12:45 | ISMP Award Ceremony, Lucky Draw and Closing Remark (Grand Ballroom) | |||||
※ This event is open to all registrants.