| November 4th, 2025 (Tue) | ||||||
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| 15:30-18:00 | Registration (Convention Hall Lobby, Main Building 2F) | |||||
| November 5th, 2025 (Wed) | ||||||
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| Room | Convention Hall A+B (600) 2F | Convention Hall C (300) 2F | Joyful Hall (300) 1F | Happy Hall (150) 1F | Ladies Hall (60) 2F | Amante Hall (50) 2F |
| Topic | A. 3D, 2.5D Integration for AI Systems (Chiplets) | B. Electrical Design and Performance | C. Advanced Packaging Materials | Special Session 1 (105 min) | Special Session 2 (105 min) | |
| Session Chair | Jang Jinwook | Han Ki Jin | Kim Sangwon | |||
| 9:00-9:25 | I1-01(Invited) Jan Vardaman, TechSearch International, Inc., USA Al Packaging Trends and Challenges |
I1-02(Invited) Kim SoYoung, Sungkyunkwan University, Korea AI-Driven Approaches to Semiconductor Package Design |
I1-03(Invited) Akane Tsukahara, Taiyo Ink Mfg. Co., Ltd., Japan Development of Low-Loss Photo-Dielectric Dry Film for Redistribution Layers in High-Speed Packaging |
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| 9:25-9:45 | O1-01Lee Eun Jung, SK inc. materials, Korea Beyond Materials: Process Optimization Strategies for Advanced Mold Applications in 2.5D and HBM Technologies |
O1-05Lee Heeseok, Samsung Electronics Co., Ltd., Korea Enhancing Computing Performance of Mobile SOC based on Co-Optimization including Die, Package and System |
O1-09Jeong Seyoung, Ntrium Inc., Korea Research on New Materials to Improve the Mechanical and Electrical Properties of Semiconductor Packages |
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| 9:45-10:05 | O1-02Kim Jun-Su, Hana Micron Inc., Korea Design and Process Development of the Fine-Pitch Organic RDL for Bridge-Die based 2.xD Package |
O1-06Park Heechun, Ulsan National Institute of Science and Technology (UNIST), Korea An EDA Perspective on Design and Optimization for Chiplet-Based Heterogeneous Integration |
I1-049:45-10:10 (Invited) Hironari Mori, Sumitomo Bakelite Co., Ltd., Japan Development of Low Temperature Curable Photosensitive Material for Redistribution Layer |
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| 10:05-10:25 | O1-03Kazuki Noguchi, Sanyu Rec Co., Ltd., Japan Optimization of Underfill for 2.5D Multi-Chip Packages Using Simulation |
O1-07Chae Suin, Hanyang University & Korea Electronics Technology Institute (KETI), Korea Design and Implementation of Bridge Embedded RDL Interposer for High-Speed Interfaces based on UCIe Standard |
O1-1010:10-10:30 Jung Sooim, Doosan Corporation Electro-Materials, Korea Development of Novel Substrate Technology for Next-Generation Memory Semiconductor Applications |
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| 10:25-10:45 | O1-04Lee Seok Won, Samsung Electronics Co., Ltd., Korea 3D Package Development based on Panel Level Packaging Technology |
O1-08Jung Haksoon, Ulsan National Institute of Science and Technology (UNIST), Korea Advanced Interconnect Design in 3D-Printed Fan-Out Interposers |
O1-1110:30-10:50 Lee Sun-Woo, Korea Advanced Institute of Science and Technology (KAIST), Korea Hybrid Multibarrier Strategies for Mechanical and Environmental Reliability: Silamer/Al2O3 and Parylene-C/Nanolaminate Thin-Film Encapsulation |
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| 10:45-11:10 | Break Time (25 min) | |||||
| Session Chair | Choi Changhwan | |||||
| 11:10-11:40 | PT1Plenary Talk 1 (Convention Hall A+B) - Bryan Black, Chipletz, Inc., USA Implications of Chiplets |
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| 11:40-12:10 | KT1Keynote Talk 1 (Convention Hall A+B) - Lee Choon Heung, Intel Corporation, USA Future of AI Advanced Packaging |
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| 12:10-13:30 | Lunch (80 min) | |||||
| Session Chair | Kim Tae-il | |||||
| 13:30-14:00 | KT2Keynote Talk 2 (Convention Hall A+B) - Kim Dae-Woo, Samsung Electronics Co., Ltd., Korea The New Era of System Package |
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| 14:00-14:30 | KT3Keynote Talk 3 (Convention Hall A+B) - Lim Sung Kyu, USC (University of Southern California), USA AI-Driven Design Automation for Multi-Chip Integration in AI Chips |
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| 14:30-14:50 | Break Time (20 min) | |||||
| Topic | E. Hybrid Bonding | F. Electrical Design and Performance | G. Advanced Packaging Materials | H. IMPACT Session | Special Session 3 (85 min) | Special Session 4 (85 min) |
| Session Chair | Lee Eun-Ho | Shin Hyunseong | Woo Yun Sung | Kim Taek-soo | ||
| 14:50-15:15 | I1-05(Invited) An Jinho, Applied Materials, Inc., Korea Innovative Solutions in Addressing the Complexity of Hybrid Copper Bonding Technology |
I1-06(Invited) Wisnu Murti, ELSPES Inc., Korea Enabling Advanced Integration with Deep Trench Silicon Capacitors |
I1-07(Invited) Takatoshi Ikeuchi, Resonac Corporation, Japan Co-Creating the Future of Materials Innovation in Advanced Packaging |
I1-0814:50-15:15 (Invited) Song Jenn-Ming, National Chung Hsing University, Taiwan Light Enhanced Direct Metal Bonding for Advanced Electronic Assembly |
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| 15:15-15:35 | O1-12Kim Sungdong, Seoul National University of Science and Education, Korea Methods to Enhance SiO2 Bonding and Reduce Cu Oxide Formation in Cu/SiO2 Hybrid Bonding |
O1-15Kim Hong Seok, Hana Micron inc., Korea Signal Integrity Analysis of RDL by Universal Chiplet Interconnect Express (UCIe) Standard for Advanced Package |
O1-18Jeong Seyoung, Ntrium Inc., Korea Thermal Interface Materials and Processes for Simple and Highly Thermal Conductive Advanced Package Structures |
I1-0915:15-15:40 (Invited) Lee Chang-Chun, National Tsing Hua University, Taiwan Warpage Estimation and Demonstration of Panel-level Fan-out Packaging with Cu Pillars Applied on a Highly Integrated Architecture |
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| 15:35-15:55 | O1-13Han Haneul, Hanyang University, Korea Additive-Free DC Electrodeposition of (111)-Oriented Nanotwinned Copper for Reliable Cu–Cu Bonding |
O1-16Choi Seongkyu, Sungkyunkwan University & Korea Institute of Industrial Technology (KITECH), Korea Warpage-based Local Strain Analysis for Reliability Evaluation of Board-level Packages Using Digital Image Correlation |
O1-19Satoshi Osawa, Nihon Gosei Kako Co., Ltd., Japan A Liquid Epoxy Encapsulant with Excellent Weather Resistance, Long-term Reliability and Casting Properties |
I1-1015:40-16:05 (Invited) Wu Albert T., National Central University, Taiwan Sintering Behavior and Bonding Mechanisms of Copper Nanoparticles for Advanced Electronic Packaging |
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| 15:55-16:15 | O1-14Yun Youngsu, SK Hynix Inc., Korea Analysis on the Effect of Process Parameters on Hybrid Bonding Reliability |
O1-17Ma Boo Soo, University of Suwon, Korea MSG (Mechanical Stress by Generative model): Clustering-Aware, Physics-Informed Deep Surrogates for Full-Field Stress Prediction in Semiconductor Packaging |
O1-20Park Soojae, OXWIRES, Korea Gas-Free & Nano TiO2-Coated Ag Bonding Wire for Replacing Au Wire |
I1-1116:05-16:30 (Invited) Lee Ming-Tsang, National Tsing Hua University, Taiwan Sustainable Laser Micro/Nanofabrication for 3D Electronics: Novel Processes Development, Transport Phenomena, and Digital Twin |
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| 16:15-16:35 | Break Time (20 min) | Break Time (5 min) | Break Time (20 min) | |||
| Topic | I. Hybrid Bonding | J. Equipment and Tools | Sponsor Night Setting | L. ICEP Session | Special Session 5 (85 min) | Special Session 6 (Closed) |
| Session Chair | Lee Eun-Ho | Moon Hyunkyu | Yasuhiro Morikawa & Go Hamasaka |
Kim Deok-Kee | ||
| 16:35-17:00 | I1-12(Invited) Cho Won-Seob, BASF, Korea Recent Development in Cu-Cu Hybrid Bonding: BASF's Innovations and Key Challenge |
I1-14(Invited) Park YongKeun, Tomocube Inc., Korea Holotomography: Advancing Metrology and Inspection for Microelectronics and Advanced Packaging |
I1-1516:35-17:00 (Invited) Go Hamasaka, Tokuyama Corporation, Japan High Thermal Conductive Aluminum Nitride Fillers for Thermal Management in Electronic Packaging |
반도체 첨단 패키징 기업 연계 융합 인재 양성(세종대학교) |
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| 17:00-17:20 | I1-1317:00-17:25 (Invited)Kasbauer Thomas, EV Group, Austria Enalbing 3D Integration: Advanced in Hybrid Wafer Bonding Technology |
O1-23Yee Hooi Low, Evatec AG, Taiwan Thin Film Deposition Developments to Enable Heterogeneous Integration with Panel Scale Solution |
I1-1617:00-17:25 (Invited) Shiori Yamada, ULVAC, Inc., Japan Manufacturing Transformation Era: Process Solution Technologies for Panel-Level Packaging Based on Wafer-Level Quality |
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| 17:20-17:40 | O1-2117:25-17:45 Kang Sukkyung, Korea Advanced Institute of Science and Technology (KAIST), Korea Plasma-Assisted Chemical-Mechanical Polishing for Cu/Polymer Hybrid Bonding Interfaces |
O1-24Choi Ji-Hoon, Aqlaser Inc., Korea Laser Application Technology for Advanced Packaged Glass Substrate (TGV, GCS) Manufacturing |
I1-1717:25-17:50 (Invited) Shinji Kato, Mitsubishi Materials Corporation, Japan Introduction of Rectangle Si Panel Technology for Advanced Packaging |
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| 17:40-18:00 | O1-2217:45-18:05 Lee Jeongsin, Samsung Electronics Co., Ltd., Korea Development of Wet Atomic Layer Etching Process for Cu Surface Topography Control in Hybrid Bonding Applications |
O1-25Zia Karim, Yield Engineering Systems, USA Resolving Critical Defects Using Specialized Fluxless Reflow for Advanced HBM Applications |
I1-1817:50-18:15 (Invited) Hirotaka Satori, EBARA Corporation, Japan Integrated Systems Strategy from the Viewpoint of an Equipment Supplier in the Advanced Packaging Era |
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| 18:00-18:20 | Break Time (20 min) | Break Time (5 min) | ||||
| 18:00-18:20 | Sponsor Night and Lucky Draw (Joyful Hall, 1F) | |||||
| November 6th, 2025 (Thu) | ||||||
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| Room | Convention Hall A+B (600) 2F | Convention Hall C (300) 2F | Joyful Hall (300) 1F | Happy Hall (150) 1F | Ladies Hall (60) 2F | Amante Hall (50) 2F |
| Topic | M. Fine Pitch Organic Substrates and Interposers | N. Fine Pitch Micro-bump Bonding | O. IEIE Session | P. Thermal Engineering | Special Session 7 (85 min) | Special Session 8 (85 min) |
| Session Chair | Kim Myung Jun | Chu Kunmo | Kim Jonghoon | Kim Jaechoon | TBD | Shin Jung Ho |
| 9:00-9:25 | I2-01(Invited) Ryohei Oishi, Ajinomoto Co., Inc., Japan Insulation Materials for Advanced Packaging Applications |
I2-02(Invited) Yoo Sehoon, Korea Institute of Industrial Technology (KITECH), Korea Microstructural and Mechanical Reliability of Fine-Pitch Interconnects Formed by LAB and TCB |
I2-03(Invited) Koo BonTae, Electronics and Telecommunications Research Institute (ETRI), Korea Energy-Efficient 10-Chiplet Hyperscale AI Semiconductor on Advanced Large-Scale RDL Package |
I2-04(Invited) Im Yunhyeok, Georgia Institute of Technology, USA Holistic Thermal Solution for Heterogeneously Integrated High-Power Packages |
균질 레이저 기반 동시 전사ᆞ접합 소재 및 공정 기술 개발 (09:00~14:30) |
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| 9:25-9:45 | O2-01Lee Jung Won, Nepes Corporation, Korea Fan-Out Embedded Bridge Interposer for Scalable Heterogeneous Integration of NPUs and HBMs |
O2-05Li Zihao, Kokusai Electric Corporation, Japan Enhancing Capillary Underfill Flow Control for 3D Heterogenous Integration with ALD-based Surface Treatments |
O2-09Jang Jin-Wook, Hana Micron Inc., Korea Critical Role of the Advanced Packaging from Components to Systems in the Era of AI |
O2-13Jang Sukwon, Samsung Electronics Co., Ltd. & Sungkyunkwan University, Korea Efficient Thermal Modeling of 3D Packages Using a New Structure of Thermal Network with Deep Learning |
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| 9:45-10:05 | O2-02Park Hyun, Dong-A University, Korea Microstructural Characteristics and Filling Behavior of Organic Additive-based Cu Electrodeposition in Microvia for Semiconductor Packages |
O2-06Shin Jungho, Electronics and Telecommunications Research Institute (ETRI), Korea Selective Formation of Bonding Materials on Micro-bumps via Laser Non-conductive Film Dipping for 20 µm Pitch Interconnections |
O2-10Kim Deok-Kee, Sejong University, Korea Heterogeneous Integration through 2.5D Silicon Interposers for Next-Generation AI and HPC Applications |
O2-14Lee Insik, Korea Advanced Institute of Science and Technology (KAIST) & Samsung Electronics Co., Ltd., Korea Thermo-hydraulic Performance Evaluation of Direct Liquid Jet-impingement Cooling with Single and Multi-phase Fluids for Chiplet Packaging |
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| 10:05-10:25 | O2-03Kim Kee-Joon, LG Electronics Inc., Korea High Resolution Laser Direct Imaging (LDI) Technology for Advanced Packaging Industry |
O2-07Lee Jeeeun, Korea Advanced Institute of Science and Technology (KAIST), Korea Flow Analysis of the Capillary Underfill Process using Physics Informed Neural Networks |
O2-11Jung Sungyeop, Korea University, Korea Electrical Design Optimization by AI and Machine Learning for Redistribution Layer Interposers |
O2-15Jeon Ju-Won, Sungkyunkwan University & Hanwha NxMD Corporation, Korea Experimental Study of Confined Jet Array Impingement Boiling on Pin-Finned Surfaces under Subcooled Inlet Conditions |
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| 10:25-10:45 | O2-04Kim Juyoul, Daeduck Electronics Co., Ltd., Korea Innovative Architecture for Component Embedding on Thick Core FCBGA Substrates |
O2-08Park JongChan, STATS ChipPAC Korea Limited., Korea Surface Activation Beneath the Flip Chip by Plasma Treatment and Intuitive Inspection Methods for Surface Energy |
O2-12Shin SangHoon, Hanyang University, Korea Advanced Packaging and Reliability: Technologies Shaping the Next Generation |
O2-16Kim Seongju, Ulsan National Institute of Science and Technology (UNIST), Korea Reinforcement Learning–Driven Custom Liquid Micro-Channel Design for Direct Liquid Cooling in Advanced Packaging |
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| 10:45-10:55 | Break Time (10 min) | |||||
| 10:55-11:10 | Opening Remark - Young-Chang Joo / KMEPS (Convention Hall A+B) | |||||
| Session Chair | Sohn Yoonchul | |||||
| 11:10-11:40 | PT2Plenary Talk 2 (Convention Hall A+B) - Son Ho-Young, SK hynix Inc., Korea Advanced Package Technology for HBM and Beyond HBM |
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| 11:40-12:10 | KT4Keynote Talk 4 (Convention Hall A+B) - Choo Hyuck, Samsung Electro-Mechanics Co., Ltd., Korea Glass Substrate for Next-Generation Semiconductor Packaging |
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| 12:10-13:10 | Lunch (60 min) | |||||
| Session Chair | Choi Changhwan, Kim Young-Cheon, Kim Youngwoo, So Hongyun | |||||
| 13:10-14:00 | Poster Presentation (Happy Hall Lobby, Main Building 1F) (50 min) | |||||
| Session Chair | Song Jae Yong | |||||
| 14:00-14:30 | KT5Keynote Talk 5 (Convention Hall A+B) - Lee Chee Ping, Lam Research Corporation, Singapore Enabling AI’s Next Leap: Advanced Packaging Powered by Equipment Innovation |
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| 14:30-15:00 | KT6Keynote Talk 6 (Convention Hall A+B) - Subramanian S. Iyer, UCLA (University of California, Los Angeles), USA Strategic Directions in Advanced Packaging |
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| 15:00-15:20 | Break Time (20 min) | |||||
| Topic | Q. Glass Core Substrate Interposers | R. Advanced Packaging Materials | S. Co-Packaged Optics | T. MEMS/Display/Wearable | Special Session 9 (Closed) | Special Session 10 (Closed) |
| Session Chair | Park Se-Hoon | Lee Kwangjoo | Choi Kwang-Seong | Kim Tae-il | Sehoon Yoo | Kwon Daeil |
| 15:20-15:45 | I2-05(Invited) Yi Yongsang, LPKF Laser & Electronics Korea Ltd., Korea, LPKF Laser & Electronics Korea Ltd., Korea Development of Glass Substrates and Trend Change Using LIDE |
I2-0815:20-15:45 (Invited) Choi MiKyoung, Amkor Technology, Korea Accelerating Time to Market through System to Material Co-Design in Advanced Packaging |
I2-10(Invited) Lars Brusberg, Corning Science & Technology, Germany Glass-Based Optical Interconnects for Co-Packaged Optics: Innovations in Coupling, Substrates, and Routing Solutions |
I2-11(Invited) Lee Jongho, Gwangju Institute of Science and Technology (GIST), Korea Stretchable Inorganic LED Displays: Design and Fabrication |
차세대 AI 반도체 초박형 기판용 TGV 핵심기술 기반구축 (소부장기술융합연구조합) |
물리기반 인공지능과 열-기계 연계 물성을 활용한 차세대 반도체 패키지 신뢰성 진단 및 방열 성능 최적화 (성균관대학교 외) |
| 15:45-16:05 | O2-17Valeria Samsoninkova, Rena Technologies GmbH, Germany Tuning of through Glass via (TGV) Shapes in Different Glass Types for Glass-Core Packaging Substrates |
O2-20Jang Jongmin, LG Chem, Korea Film Adhesive Solutions for Thin & High Stack Memory |
O2-23Nam Donguk, Korea Advanced Institute of Science and Technology (KAIST), Korea Integrated Light Source Technologies for Photonic-Integrated Circuits |
O2-27Bae Byeong-Soo, Korea Advanced Institute of Science and Technology (KAIST), Korea Zero CTE Advanced Semiconductor Packaging Substrate/Foldable High-Frequency PCB Substrate with Low Dk/Df Siloxane Elastomer |
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| 16:05-16:25 | O2-18Kim Sung-Bin, AnyCasting Co., Ltd., Korea Analysis of Microstructure for Achieving Zero Void in Cu Metallization of Through Glass Vias in Glass Core Substrate |
I2-0916:10-16:35 (Invited) Seok Seong-Ho, Corning Technology Center Korea, Korea Corning TGV (Through Glass Via) Substrate: Innovative Solutions for Advanced Packaging |
O2-24Choi Samuel Seongwook, LIPAC Co., Ltd., Korea FOWLP as a Versatile Packaging Platform for CPO/NPO Engines in Future Data Centers |
O2-28Jung Yei Hwan, Hanyang University, Korea Assembly and Integration of Micro-LED Display |
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| 16:25-16:45 | I2-06(Invited) Jeon Eunsuk, Laserapps Co., Ltd., Korea Micro-Crack Free Laser Singulation and Melting TGV for Glass Substrate and Interposer |
O2-2116:30-16:50 Tetsu Yonezawa, Hokkaido University, Japan Enhanced Low-Temperature Sinter Bonding by Hybridization of Self-Reducible CuxO and Metallic Cu Nanoparticles |
O2-25Kim Seung Gun, Kookmin University, Korea Optimization and Robust Packaging of 493 nm Inversely Tapered Edge Couplers for Ba+ Ion Trap Quantum Computing Platforms |
O2-29Cho Byoung-Gu, AGASemicon Corp., Korea Novel, integrated solution for Micro-LEDs Using PR Expansion (Mass Transfer and Bonding Strategy) |
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| 16:45-17:05 | I2-0716:50-17:15 (Invited) Jung Il Hyung, BSP Co., Ltd., Korea TGV (Through glass via) Formation Using a Femtosecond Pulsed Laser |
O2-2216:50-17:10 Lee Hyun Jin, MK Chem & Tech Co., Ltd., Korea Surface Treatment Technology for Semiconductor Packaging Substrates |
O2-26Kim Younghyun, Hanyang University, Korea Silixon Nitride Photonics on Glass Substrate Platform for Optical RDL in Scale-in Optical Interconnect |
O2-30Jeong Jae-Woong, Korea Advanced Institute of Science and Technology (KAIST), Korea Versatile Fine-Pitch Bonding with Low-Melting-Point Alloys for Advanced Electronic Integration |
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| 17:05-18:30 | Banquet Setting | Break Time (85 min) | 17:30~18:20 General Meeting (Amante Hall) | |||
| 18:30-20:30 | Banquet (Convention Hall A+B, 2F) | |||||
| November 7th, 2025 (Fri) | |||||||
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| Room | Convention Hall A (300) 2F | Convention Hall B (300) 2F | Convention Hall C (300) 2F | Joyful Hall (300) 1F | Happy Hall (150) 1F | Ladies Hall (60) 2F | Amante Hall (50) 2F |
| Topic | U. Reliability | V. Equipment and Tools | W. Metrology and Inspection | X. Young Scientist I | Y. Young Scientist II | Special Session 11 (Closed) | Special Session 12 (Closed) |
| Session Chair | Ryu Ill | Lee Yong-Seok | Lee Joohyung | Kim Young-Cheon | Noh Wooram | Sohn Yoonchul | Jung Yei Hwan |
| 9:00-9:25 | I3-01(Invited)Park Ah-Young, University of Seoul, Korea |
I3-03(Invited)Lee Sun-Ghil, Tokyo Electron Korea Ltd., Korea Unlocking New Frontiers: Wafer-Level 3D Integration Technology for High Performance Computing and AI Applications |
I3-06(Invited)Isabella Drolz, Comet, Germany AI Meets X-ray: The New Standard in Non-Destructive Chip-on-Wafer Inspection |
O3-159:00-9:15 Yoo Woongkyoo, Hanyang University, Korea Prediction of the Warpage for Large-scale Semiconductor Package using Equivalent Model Considering the Anisotropic Thermomechanical Properties based on Multi-physics Simulation |
O3-259:00-9:15 Kim Sang Hoon, Sungkyunkwan University, Korea Impact of Plastic Deformation at the Cu-Cu Hybrid Bonding Interface on Signal Integrity in High-Bandwidth Memory Channels |
Training of Semiconductor Advanced Packaging Specialists (Chosun University, Chonnam National University Gwangju Institute of Science and Technology, Inha University) |
차세대 3D 패키징을 위한 저온, 저압공정용 이방성 전도성 접착소재 및 공정 개발 (성균관대학교, 한양대학교, STECO) |
| 9:25-9:45 | O3-01Yeon Hanwool, Gwangju Institute of Science and Technology (GIST), Korea Addressing Thickness-performance Dilemmas in Electromagnetic Interference Shields by Metal-MXene Heterostacking |
O3-06Jeong Jihoon, Texas A&M University, USA Self-Focusing Control for Depth-Precise Wafer Slicing of 4H-SiC in Femtosecond Laser Processing |
O3-10Park Poomseong, SK hynix Inc., Korea MI (Metrology & Inspection) Challenges in FOWLP Process |
O3-169:15-9:30 Gwak Wan-Gyu, Sungkyunkwan University, Korea Efficient Prediction of Wafer-Radius Ion Energy and Angular Distributions with Machine Learning for Plasma Based Pre-Bonding Processes |
O3-269:15-9:30 Jung Hyunwoo, Sungkyunkwan University, Korea Image-Based Probabilistic Prediction of Effective Thermal Conductivity in Cu–BAs via Cross-Validated FFT-Based Spectral and FEM Homogenization |
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| 9:45-10:05 | O3-02Lee So-Yeon, Inha University, Korea Enhancing Metal Interconnect Reliability through Strain Engineering |
O3-07Han Seunghwoi, Chonnam University, Korea Direct-Writing of 3D Conductive Patterns within and on Transparent Structures |
O3-11Kim Hyuntae, Park Systems, Korea AFM Technology for Semiconductor Metrology and Inspection |
O3-179:30-09:45 Lee Siye, Seoul National University of Science and Technology, Korea Impact of Surface Oxidation on Cu-Cu Bonding in Hybrid Bonding |
O3-279:30-09:45 Han Dugkyu, Hanyang University, Korea Electrical and Reliability Characterization of PSPI-Based Redistribution Layers for Advanced Packaging |
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| O3-189:45-10:00 Kim Kyungmin, Sungkyunkwan University, Korea Mechanically Robust and Reworkable Microchip Packaging via Liquid Metal-based Anisotropic Conductive Adhesive |
O3-289:45-10:00 Sarfraz Muhammad Salman, Korea Advanced Institute of Science and Technology (KAIST), Korea Development of Low-Viscosity, High-Thermal-Conductivity Capillary Underfills for Advanced Chip Packaging |
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| 10:05-10:25 | O3-03Kim Jong-Hyoung, Pukyong National University, Korea Local Film Stress Evaluation via FIB-µDIC Slitting Method |
I3-0410:05-10:30 (Invited) Kim Young-Jin, Korea Advanced Institute of Science and Technology (KAIST), Korea Ultrafast Photonics for Ultra-Precision: New Applications in Non-Destructive Testing (NDT) |
O3-12Rho Jinsung, Hanbat National University, Korea Advanced Pulsed Thermography with Deep Learning for Micro-Crack Inspection in EMC Molding of Semiconductor Packages |
O3-1910:00-10:15 Lim Jaeseung, Korea Institute of Machinery and Materials (KIMM), Korea Femtosecond pulsed Laser-Induced Forward Transfer for VCSEL Integration |
O3-2910:00-10:15 Gu Chang-Yeon, Korea Advanced Institute of Science and Technology (KAIST), Korea Prediction of Long-term Warpage in Semiconductor Packages Considering Thermal Aging of Epoxy Molding Compound |
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| O3-2010:15-10:30 Jang Jiwoo, Hansung University, KoreaDeveloping Physical AI for Semiconductor Packaging Machines: Practices in Saw Singulation | O3-3010:15-10:30 Kim Jaehoon, Korea Advanced Institute of Science and Technology (KAIST), KoreaIsotope-Enriched Cubic Boron Arsenide with Ultrahigh Thermal Conductivity | ||||||
| 10:25-10:45 | Break Time (20 min) | Break Time (15 min) | Break Time (20 min) | Break Time (15 min) | Special Session 13 (120 min) | Special Session 14 (Closed) | |
| Session Chair | Ryu Ill | Lee Yong-Seok | Lee Joohyung | Kim Young-Cheon | Kim Seongju | Sohn Yoonchul | Kim Hyeok |
| 10:45-11:10 | I3-02(Invited) Kim Wonbin, Samsung Electronics Co., Ltd., Korea Accelerated Reliability Evaluation and Conduction Mechanisms of Solder Resist in Fine-Pitch Substrates |
I3-05(Invited) Vikram Turkani, PulseForge Inc., USA Enabling Scalable Heterogeneous Integration with Photonic Debonding Technology |
I3-07(Invited) Lee Bongsub, Adeia Inc., USA Hybrid Bonding Metrology: Pre- and Post-Bond Analysis for High Yield and Throughput |
O3-2110:45-11:00 Hwang Jae Young, Seoul National University, Korea TDTR-Based Thermal Transport Measurement and Modeling of Cu-Cu Bonding with Metal Passivation |
O3-3110:45-11:00 Kim Jahyeon, Korea Institute of Industrial Technology (KITECH), Korea Research on Co-Soldering Optimization for Next-Generation Electronic Packaging: SAC305/Sn-Bi |
잉크젯 프린팅 공정을 이용한 저가형 패널 레벨 첨단 패키징 유기 RDL 인터포저 기술 개발 (서울시립대학교 외) |
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| 11:10-11:30 | O3-04Kim Jun-Yeop, Nexensor Inc., Korea The Study of Warpage and Micro-structure Measurement in HBM Process |
O3-08Jeong Hakung, Korea Institute of Machinery and Materials (KIMM), Korea Equipment Technologies for High-Reliability Bonding and Interconnect Processes in Advanced Packaging |
O3-13Kim Ilkwang, Kovis Technology Co., Ltd., Korea High-Speed C-SAM Inspection for Detecting Micro Defects in HBM Stacking and W2W Bonding Processes |
O3-2211:00-11:15 Yeon Kyeongmi, Seoul National University, Korea Dislocation Plasticity in Thin-Films under Inhomogeneous Loading for Semiconductor Packaging Reliability |
O3-3211:00-11:15 Kim Seonwoo, Korea Electronics Technology Institute (KETI), Korea Novel Fine Patterning Technology for Bridge Embedded RDL Interposer |
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| 11:30-11:50 | O3-05Lim Hyukjun, Seoul National University, Korea Real-Time Prediction of TSV Thermal Fatigue Reliability in HBM Using FEA-Guided U-Net-Based Deep Learning Framework |
O3-09Jeong Hyeong-Jun, Samsung Electronics Co., Ltd., Korea, Affiliation, Korea A Study on the Improving Accuracy of Optical 3-D Profile Measurement using In-Wafer Gradient of Dimensionally Reduced Ellipsometry Spectrum |
O3-14Jang Jaeyoung, Nexensor Inc., Korea Fast and Precise CMP Metrology via Phase-Shifting Interferometry and Active-Probe Atomic Force Microscopy |
O3-2311:15-11:30 Shin Seungik, Korea Institute of Machinery and Materials (KIMM), Korea Fatigue Life of Single Thermoelectric Solder Joints under Peltier-Induced Thermal Cycling |
O3-3311:15-11:30 Lee Jeongheon, Chosun University, Korea A Review of the Electromigration Reliability for SnBi based Solder Joints |
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| O3-2411:30-11:45 Min Kyoungyeon, Hanyang University, Korea Hybrid Bonding at Low Temperature Enabled by Plasma-Activated Polymer–Inorganic Dielectric Interfaces |
O3-3411:30-11:45 Kwon Guhyeon, Seoul National University, Korea Moisture-Dependent Leakage Current Behavior of Photo-Imageable Dielectric (PID)-based Redistribution Layers (RDLs) |
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| 12:00-12:30 | ISMP Award Ceremony, Lucky Draw and Closing Remark (Convention Hall B, 2F) | ||||||