ISMP 2025

ISMP 2025 will include all basic/applied sciences and technologies in the fields of electronic materials, devices, and packaging. Topics may include, but are not limited to, the following areas:

This includes electrical/mechanical/thermal/optical design & analysis. Furthermore, this includes electrical/mechanical/thermal/optical co-design, co-simulation & multi-physics analysis.

• Electrical: High-speed signal integrity (SI), power integrity (PI), Electromagnetic Interference/Compatibility (EMI/EMC).
• Thermal: Thermal Design Power, Structure configuration, Material selection, Thermal Resistance.
• Mechanical: Warpage control, structure strength, stress analysis, reliability.
• Optical: Optical coupling, co-packaged optical solution, high-precision integration

This division is dedicated to covering the full spectrum of processes and technologies related to semiconductor packaging and is structured into five specialized subcommittees, each focusing on a critical area of packaging process and technology:

• Flip Chip Bonding: This focuses on bonding technologies using solder bumps, including flip chip assembly processes.
• Hybrid Bonding: Dedicated to the emerging field of hybrid bonding, this addresses wafer-to-wafer and die-to-wafer bonding processes, enabling fine-pitch interconnects for 3D integration.
• RDL Process: This covers wafer-level processes for forming Redistribution Layers (RDL), including photolithography, metallization, and planarization techniques essential for advanced packaging.
• 2.5D: Focused on 2.5D System-in-Package (SiP) technologies, this explores the processes required for interposer fabrication and integration, such as silicon and organic interposers.
• 3D: This covers a broad range of 3D packaging processes and technologies. It also encompasses conventional packaging techniques to provide a comprehensive view of 3D and traditional package manufacturing.

Innovative methodologies and materials for substrate and interposer-based packaging technology applicable to high-performance electronic systems. Advanced substrate and interposer structures, including organic, ceramic, and glass-based solutions. Basic and applied science and technology developing next-generation solutions for high-performance applications such as 5G/6G, computing, artificial intelligence, automotive and networking.

This program focuses on semiconductor components and devices for integration in advanced packaging technologies. Submission are invited on a range of topics, including active devices (e.g., logic, memory, high-speed I/O), passive components (e.g., capacitors, inductors, resistors), and embedded devices integrated within advanced packaging platforms. Areas of interest also incluse innovations in component design, materials, and process integration for 2.5D/3D ICs, system-in-package (SiP), and chiplet-based architectures.

Advanced packaging materials for current and next generation semiconductor packaging including structural materials, interconnect materials, functional materials, RDL and etc.

Advanced packaging equipment and test/MI equipment for next generation packaging device including fine pitch bumping technology, bumpless bonding, 2.5D/3D heterogeneous integration, fine pitch test, metrology, inspection and etc.

Advanced metrology encompasses precision measurement techniques for critical dimensions, material properties, and electrical characteristics in microelectronics and packaging systems, including dimensional analysis, thermal profiling, and mechanical stress evaluation to ensure compliance with manufacturing specifications. Inspection methodologies focus on defect detection and quality assessment through innovative algorithms for pattern recognition, defect classification, and failure analysis to identify structural anomalies and process variations. The division integrates both disciplines to develop comprehensive quality assurance frameworks that enhance manufacturing yield, product reliability, and statistical process control throughout the production lifecycle

Reliability evaluation of system integration (chip contacts, advanced packages, hetero-integration in assemblies and subsystems) for contemporary and advanced electronic devices and systems. In order to obtain practical diagnostic methods for device reliability, emphasis is placed on new concept of test systems and procedure, characterization and analysis. In addition, testable and predictable multiscale and multi-physics modeling is also included.

* It should be noted that the program committee reserves the right to make a final decision on the session and presentation type of oral or poster regardless of author’s preference.