ISMP-IRSP 2024 will include all basic/applied sciences and technologies in the fields of electronic materials, devices, and packaging. Topics may include, but are not limited to, the following areas:
Novel packaging technologies and related recent trends for IT technologies including artificial intelligence (AI), internet of things (IoT), machine learning, big data, medical packaging and etc. Packaging solutions for 5G/6G communications including 5G sub-6GHz RFFEM (PAMiD , DRx), 5G mmW discrete antenna, 5G mmW FEM Antenna-in-Package (AiP) for 5G/6G and radar systems, high-frequency & speed modules and Systems and etc.
Innovative electronic materials for microelectronic and packaging including interconnect materials, adhesives, epoxy mold compound, bonding wire and etc.
Advanced packaging process for system integration including fan-out/fan-in wafer level packaging, panel level packaging, 3D integration, embedded structures, micro-bonding, hybrid bonding, TSVs, TEVs, TMVs, TGVs, via plating, advanced substrates, interposers and etc.
Advanced packaging equipment for next generation packaging system including fine pitch bumping technology, bumpless bonding, 2.5D/3D heterogeneous integration and etc.
Design and simulation of microelectronic and packaging technology for analysis of high-speed signal, power integrity, high-frequency & speed modules and Systems, heterogenous chiplet modules and etc.
Characterization and modelling of advanced packaging structure. Thermo-mechanical modelling and characterization of PCB, 2.5D/3D package, and etc.
Reliability evaluation of system integration (chip contacts, packages, assemblies and subsystems) for conventional and upcoming electronic devices and systems including new concept of test systems and procedure, characterization and analysis, and etc.
Basic and applied science and technology for innovative PCB assembly and production process including printed circuit board, electroplating, electroless plating, surface finish, high reliable novel solder, low and high temperature solder, solder joint properties, interfacial reaction, solder printing process, reflow, wave soldering, press-fit process, novel assembly technologies and etc.
Innovative solution for power electronics in automotive applications including bonding materials, TLP, ribbon bonding, wide bandgap power semiconductor devices (e.g. SiC, GaN, GaAs), novel cooling solutions (e.g. double-sided cooling, bond-wire-less), power embedding, high voltage solutions and etc.
Emerging packaging technology suitable for the application to MEMS/NEMS, sensors, and display such as biosensor, chemical sensor, nano-packaging, bio-electronics and microfluidics, micro LED, OLED and etc.
Next-generation electronics devices including thin film transistor (TFT) process and materials, advanced memory devices, neuromorphic devices, 2D material-based electronics, emerging nano devices.
Recent progress on flexible, wearable, and printed electronics including stretchable electronic devices, stretchable substrates, flexible hybrid systems, printed/jetted (transparent) conductors, touch and large area sensors, signage and displays, paper electronics, printed thin film PV and photodetectors, energy storage and harvesting, wearable sensors/actuators and etc.
* It should be noted that the program committee reserves the right to make a final decision on the session and presentation type of oral or poster regardless of author’s preference.