Young-Chang Joo
General Chair
It is our great pleasure to announce that the 23rd International Symposium on Microelectronics and Packaging (ISMP 2025) will be held at Bareumi Hotel Inter-Burgo Daegu, Daegu Metropolitan City, Korea, on November 4 (Feb)~7 (Fri), 2025. The ISMP organized by KMEPS (The Korean Microelectronics and Packaging Society) presents a valuable chance to share the latest electronic packaging technologies including novel packaging technologies, packaging materials, process, equipment, design, reliability and so on. The ISMP 2025 organizing committee promises to provide an outstanding and fruitful program, which will be a great opportunity that you do not miss. We cordially invite you to submit abstracts for oral and poster presentation. We look forward to meeting you at ISMP 2025 in November.