Sayoon Kang
General Chair
It is our great pleasure to announce that the 22nd International Symposium on Microelectronics and Packaging joined with the 18th International Conference Reliability and Stress-Related Phenomena in Nanoelectronics (ISMP-IRSP 2024) will be held at Paradise Hotel Busan, Korea, on November 6 (Wed)~8 (Fri), 2024. The ISMP organized by KMEPS (The Korean Microelectronics and Packaging Society) presents a valuable chance to share the latest electronic packaging technologies and IRSP discusses coupled electro-thermal-mechanical complexities in materials, devices, circuits, packages, and systems that crucially affect the design and technology of electronics.
The ISMP-IRSP 2024 organizing committee promises to provide an outstanding and fruitful program, which will be a great opportunity that you do not miss. We cordially invite you to submit abstracts for oral and poster presentation. We look forward to meeting you at ISMP-IRSP 2024 in November.