Young-Chang Joo
General Chair
It is our great pleasure to announce that the 24th International Symposium on Microelectronics and Packaging (ISMP 2026) will be held at Bexco, Busan, Korea, on November 3 (Feb)~6 (Fri), 2026. The ISMP organized by KMEPS (Korean MicroElectronics Packaging Society) presents a valuable chance to share the latest electronic packaging technologies including novel packaging technologies, packaging materials, process, equipment, design, reliability and so on. The ISMP 2026 organizing committee promises to provide an outstanding and fruitful program, which will be a great opportunity that you do not miss. We cordially invite you to submit abstracts for oral and poster presentation. We look forward to meeting you at ISMP 2026 in November.