Sayoon Kang

General Chair

It is our great pleasure to announce that the 21st International Symposium on Microelectronics and Packaging (ISMP 2023) will be held at Busan, Korea, on October 25th (Wed.) ~ 27th (Fri.), 2023. The ISMP 2023, organized by KMEPS (the Korean Microelectronics and Packaging Society), presents a valuable chance to share the latest electronic packaging technologies with other professionals as well as to boost communication and collaboration with colleagues around the world. The ISMP 2023 organizing committee promises to provide an outstanding and fruitful program, which will be a great opportunity that you do not miss. We cordially invite you to submit abstracts for oral and poster presentation. We look forward to meeting you at ISMP 2023 in Busan, Korea on October 25th (Wed.) ~ 27th (Fri.), 2023.